Abstract. The study of high density integrated optoelectronic circuits involves the development of hybrid integration technologies and the generation of models for the optoelectronic devices. To meet these goals, in the beginning a methodology for the heterogeneous integration of epitaxial GaAs wafers with fully processed standard bipolar complementary metal-oxide-semiconductor Si wafers is presented. The complete low-temperature wafer bonding process flow, based on SOG/SIO 2 , including procedures for the Si wafer planarization and GaAs substrate removal, has been developed and evaluated. The implementation of an in-plane optical link, consisting of an edge-emitting laser diode, a waveguide and a photodiode, is demonstrated. Further investigation on heterogeneous integration is achieved by presenting a second methodology. The integration of complete optoelectronic dies, consisting of optical sources and detectors connected by waveguides for the employment of a photonic layer above CMOS integrated circuits has been proposed. Photonic dies are integrated to CMOS circuits through a novel metallic bonding technique that utilizes a thin multilayer structure of the Au-20Sn eutectic alloy along with a starting layer of a rare earth element (Gd). Its main advantage is the accomplishment of mechanical bonding and electrical connectivity of the heterogeneous devices in a single step. The study of photonic microsystems demands also the modeling of specific OE devices. Under this scope, an efficient model scheme that combines the non-linear behavior of the input parasitics with the intrinsic fundamental device rate equations of the Vertical Cavity Surface Emitting Lasers (VCSELs) is proposed. A systematic methodology for the model parameter extraction from dc and ac, electrical and optical measurements, is also presented and simulation results are compared with the experimental measurements. Extraction and simulation procedures are implemented in commercial integrated circuit design tools and they are proved to be very fast while they preserve adequate accuracy.