Driving mechanisms of delamination related reliability problems in exposed pad packages

Driel, W.D. van; Bressers, H.K.L.; Janssen, J.H.J.; Bielen, J.A.; Yan, Xiantao; Gils, M.A.J. van; Stevens, Philippe; Habets, P.J.J.H.A.; Zhang, G.Q.; Ernst, L.J.

doi:10.1109/esime.2005.1502797

Cited by 15 publications

(2 citation statements)

References 17 publications

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“…In the four-point bending (FPB) test [2], a stable crack propagation results in a constant load during delamination, which simplifies the determination of the fracture resistance because it is independent on the delamination length. Theoretical formula is available to calculate the fracture toughness.…”

Section: Fig 1 Methods Of Interface Characterization [1]mentioning

confidence: 99%

Ensuring Accurate Results in Fracture Mechanics Four-Point Bending Interface Characterization

Talledo¹

2021

JERR

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Interface adhesion tests are conducted to obtain a quantitative value of the adhesion strength or interface fracture toughness to forecast initiation and propagation of interface delamination failures in semiconductor packages. One of the common methods of fracture mechanics interface characterization is the four-point bending test. Problems with the experimental setup would result in having inaccurate results. In this study, different issues with the four-point bending test using mold/copper bi-material beam with notch were addressed. It was shown that incorrect anvil alignment and centering could give inaccurate fracture toughness results. The distance between anvil supports and the depth of the notch is also very important. From the study, it can be concluded that issues with experimental setup and the test sample must be addressed to ensure accurate results from four-point bending interface characterization.

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Section: Fig 1 Methods Of Interface Characterization [1]mentioning

confidence: 99%

Ensuring Accurate Results in Fracture Mechanics Four-Point Bending Interface Characterization

Talledo¹

2021

JERR

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“…There are other several studies [6][7][8] on reliability issues with packages under cyclic bending but focusing on the solder joint crack and not on package crack that is considered in the current study. Four point bending test of an overmolded leadframe sample was done by van Driel et al [9] with the purpose of measuring the interface fracture toughness to address package interface delamination issues. Durability test on QFN packages under constant cyclic bending loadings was also analyzed using the approaches of signal processing technique involving comparison of strain response [10].…”

Section: Original Research Articlementioning

confidence: 99%

Understanding Package Crack Signatures in a Leadframe Semiconductor Package

Talledo¹

2021

JERR

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This paper presents the simulation approach used to understand package crack signatures of a leadframe package under different mechanical loading scenarios. Package crack is one of the common problems with semiconductor packages. A better understanding of the different crack signatures would help identify the root cause quickly and be able to find the correct solution. In this study, a high precision materials testing system was used to apply mechanical loading to the package simulating different scenarios that could produce the crack. Based on the testing results, cracks have distinct signatures depending on how the force is applied. With the different signatures identified, this approach makes it easy to find the root cause of the crack in actual applications or assembly processes and resolve the problem faster.

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