Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Abstract

The influence of two kinds of surface finish, namely electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on the interfacial reactions and drop reliability of epoxy-enhanced Sn-58 wt.%Bi solder has been investigated after temperature-humidity storage tests. The chemical composition and morphology of intermetallic compounds (IMCs) were characterized by scanning electron microscopy, energy-dispersive x-ray spectroscopy, and electron probe microanalysis. Also, the mechanical reliability of solder joints was evaluated using board-level drop tests. The Sn-Bi epoxy solder/ENEPIG joint exhibited higher IMC growth rate than the Sn-Bi epoxy solder/ENIG joint. After 500 h at 85°C/ 85% RH storage condition, new IMCs were formed on the Ni 3 Sn 4 layer in samples with both surface finishes. The results of board-level drop tests showed that the number of drops was higher for the ENIG than the ENEPIG surface finish. Solder joint fracture occurred along the interface between the solder and IMC layer for the ENIG surface finish. However, with the ENEPIG surface finish, the crack propagated between the IMCs.

Kesan Gelombang Kejutan terhadap Sifat Mikromekanik Sambungan Pateri SAC 0307/ENiG menggunakan Pendekatan Pelekukan Nano

“…Kegagalan struktur mekanik sambungan pateri akan mengakibatkan suatu peranti tidak dapat berfungsi dengan baik. Kebolehharapan sambungan pateri adalah sangat penting bagi jangka hayat pakej elektronik kerana sambungan pateri dalam pakej elektronik terdedah kepada kegagalan di bawah keadaan persekitaran seperti suhu, kelembapan, habuk, kejutan dan getaran (Myung et al 2016). Sebagai contoh, bagi aplikasi aeroangkasa, adalah sangat penting untuk mengekalkan kebolehharapan peranti elektronik sekurang-sekurangnya selama 20 tahun (Marques et al 2014).…”

Kesan Kemasan Permukaan Berbeza terhadap Sifat Mikromekanik Sambungan Pateri Sac 0307 menggunakan Pendekatan Pelekukan Nano

“…Seiring dengan penggunaan bahan bebas Pb, maka bahan untuk kemasan permukaan juga seharusnya bebas Pb agar dapat menghasilkan sambungan pateri yang baik dengan bahan pateri bebas Pb. Antara kemasan permukaan yang biasa digunakan pada bahan penglogaman Cu ialah ImSn, ENiG, NiAu, OSP, ENEPIG dan ImAg (Ding et al 2015;Kotadia et al 2014;Liu et al 2016;Myung et al 2016). Kebanyakan kemasan permukaan berfungsi untuk mengelakkan resapan Cu ke dalam pateri bagi mengurangkan pertumbuhan sebatian antara logam (IMC) berlebihan yang boleh menyebabkan kerapuhan antarsambungan pateri.…”

Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints

“…In the past few years, owing to the excellent wetting and high bonding strength, the development and performance evaluation of Sn-based solder materials containing epoxy have been research hotspots [23][24][25]. Jung et al [26] found that the addition of epoxy to Sn-58Bi solder lowered the activation energy for IMC growth and thus reduced the IMCs' growth rate during aging, resulting in higher fracture energy and shear strength of the joint.…”