Drop Shock Testing Analysis at Elevated Temperature: Assessing SAC305 Solder Alloy Reliability in BGA Assemblies

Vyas, Palash Pranav; Alahmer, Ali; Bolanos, Sergio; Alavi, Seyed Soroosh; Hamasha, Sa’d

doi:10.1109/tcpmt.2024.3424343

IEEE Trans. Compon., Packag. Manufact. Technol.

2024

DOI: 10.1109/tcpmt.2024.3424343

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Drop Shock Testing Analysis at Elevated Temperature: Assessing SAC305 Solder Alloy Reliability in BGA Assemblies

Palash Pranav Vyas,

Ali Alahmer,

Sergio Bolanos

et al.

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Drop Shock Testing Analysis at Elevated Temperature: Assessing SAC305 Solder Alloy Reliability in BGA Assemblies

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References 27 publications

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