Droplet-Confined Electroplating for Nanoscale Additive Manufacturing: Current Control of the Initial Stages of Growth of Copper Nanowires

Nydegger, Mirco; Spolenak, Ralph

doi:10.1021/acselectrochem.4c00085

ACS Electrochem.

2024

DOI: 10.1021/acselectrochem.4c00085

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Droplet-Confined Electroplating for Nanoscale Additive Manufacturing: Current Control of the Initial Stages of Growth of Copper Nanowires

Mirco Nydegger,

Ralph Spolenak

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Droplet-Confined Electroplating for Nanoscale Additive Manufacturing: Current Control of the Initial Stages of Growth of Copper Nanowires

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References 28 publications

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