Dry etch processing in fan-out panel-level packaging - An application for high-density vertical interconnects and beyond

Schein, Friedrich-Leonhard; Voigt, Christian; Gerhold, Lutz; Tsigaras, Ioannis; Elghazzali, Mohamed; Sawamoto, Hirofumi; Strolz, Ewald; Rettenmeier, Roland; Kahle, R.; Böttcher, Lars

doi:10.1109/ectc51906.2022.00242

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Dry etch processing in fan-out panel-level packaging - An application for high-density vertical interconnects and beyond

Cited by 4 publications

References 8 publications

Multiple System and Heterogeneous Integration with TSV-Less Interposers

Multiple System and Heterogeneous Integration with TSV-Less Interposers

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