2012
DOI: 10.3390/molecules170910119
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Dry Etching of Copper Phthalocyanine Thin Films: Effects on Morphology and Surface Stoichiometry

Abstract: We investigate the evolution of copper phthalocyanine thin films as they are etched with argon plasma. Significant morphological changes occur as a result of the ion bombardment; a planar surface quickly becomes an array of nanopillars which are less than 20 nm in diameter. The changes in morphology are independent of plasma power, which controls the etch rate only. Analysis by X-ray photoelectron spectroscopy shows that surface concentrations of copper and oxygen increase with etch time, while carbon and nitr… Show more

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Cited by 7 publications
(5 citation statements)
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“…To better control the shape and size of the organic photoactive nanocolumns, Brett et al [103,395,403] thoroughly investigated the evolution of the morphology and porosity of a OAD-CuPc thin film using a pre-seeded ITO substrate (Fig. 5.8(C)) [103].…”
Section: Organic Solar Cellsmentioning
confidence: 99%
“…To better control the shape and size of the organic photoactive nanocolumns, Brett et al [103,395,403] thoroughly investigated the evolution of the morphology and porosity of a OAD-CuPc thin film using a pre-seeded ITO substrate (Fig. 5.8(C)) [103].…”
Section: Organic Solar Cellsmentioning
confidence: 99%
“…A material’s surface texture affects local surface area and surface energy and hence has tremendous effect on its utility . The effect of surface texture has inspired advances like superhydrophobic/superhydrophilic and self-cleaning materials. High surface area also affects adsorption of small molecules and particles, hence, potential applications in catalysis and drug delivery. Most methods that modify surface texture are additive, subtractive, or a combination of both. Additive methods rely on introduction of chemi- or physisorbed adducts on the surface, whereas subtractive methods achieve this goal by selective partial removal of material to alter surface features. In addition, top-down, bottom-up, , and interfacial methods are also utilized to obtain characteristic surface patterns.…”
Section: Introductionmentioning
confidence: 99%
“…Several approaches have been used for comprehensive investigation of the buried interfaces, e.g. (i) step-by-step deposition and simultaneous investigation, 25 (ii) ion-etchingassisted examinations, 26 and (iii) synchrotron radiation-based photoelectron spectroscopy experiments. 27 Though these methods yield detailed information, they possess a number of disadvantages, like complicated setup combining processing technology with detection (i and iii), possible sample damage with the probability of selective etching (ii), and finally, the overall cost limits general accessibility.…”
Section: Introductionmentioning
confidence: 99%