2021
DOI: 10.3390/mi12060632
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Dry Film Resist Laminated Microfluidic System for Electrical Impedance Measurements

Abstract: In micro-electrical-mechanical systems (MEMS), thick structures with high aspect ratios are often required. Dry film photoresist (DFR) in various thicknesses can be easily laminated and patterned using standard UV lithography. Here, we present a three-level DFR lamination process of SUEX for a microfluidic chip with embedded, vertically arranged microelectrodes for electrical impedance measurements. To trap and fix the object under test to the electrodes, an aperture is formed in the center of the ring-shaped … Show more

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Cited by 14 publications
(14 citation statements)
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“…The fabrication process of the microfluidic chip was recently published [ 23 , 24 , 27 ] and is briefly summarized here. Three 25 µm thick SUEX ® dry film resist layers were laminated, patterned by standard UV lithography, and in the case of forming the 35–36 µm in diameter microholes, structured by a dry etching process in an inductively coupled plasma reactive ion etching tool (SI 500, SENTECH Instrument GmbH, Berlin, Germany) by applying 60 sccm O 2 , 3 sccm SF 6 , 0.5 Pa, 100 W power, and −150 V DC-bias voltage.…”
Section: Methodsmentioning
confidence: 99%
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“…The fabrication process of the microfluidic chip was recently published [ 23 , 24 , 27 ] and is briefly summarized here. Three 25 µm thick SUEX ® dry film resist layers were laminated, patterned by standard UV lithography, and in the case of forming the 35–36 µm in diameter microholes, structured by a dry etching process in an inductively coupled plasma reactive ion etching tool (SI 500, SENTECH Instrument GmbH, Berlin, Germany) by applying 60 sccm O 2 , 3 sccm SF 6 , 0.5 Pa, 100 W power, and −150 V DC-bias voltage.…”
Section: Methodsmentioning
confidence: 99%
“…Therefore, we developed a microfluidic approach in which the optical method is replaced with an observer-independent electrical detection method [ 23 , 24 ]. The schematic drawing of the setup is shown in Figure 1 a.…”
Section: Introductionmentioning
confidence: 99%
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“…Therefore, a balanced, which means a radially symmetrical, flow profile at the aperture is vital. In addition, for the electrical characterization of single cells with electrical impedance spectroscopy [11][12][13][14][15][16][17][18] or DOI: 10.1002/pssa.202200862…”
Section: Introductionmentioning
confidence: 99%
“…Lamination onto patterned dry film resist is more challenging, however, risking damage to the underlying features and poor layer-to-layer adhesion. Lamination onto patterned layers may be possible if only a small percentage of the underlying resist layer is removed during development, such as when microfluidic devices are directly constructed out of dry film resist [ 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 ]. However, microfluidic molds typically require most of each resist layer to be removed during development.…”
Section: Introductionmentioning
confidence: 99%