2020
DOI: 10.3390/chemengineering4010009
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Drying-Induced Strain-Stress and Deformation of Thin Ceramic Plate

Abstract: Ceramic thin plates are applied to several industrial purposes including electronic materials and sensors. Drying-induced shrinkage and strain-stress formation of a ceramic thin plate were studied experimentally and theoretically. A kaolin thin plate molded into 10 mm × 30 mm × 1 mm was dried in a hot air stream, and the drying characteristics and deformation were examined. Modeling was also performed to predict the behavior. Heat and moisture transfer conservation equations and constitution equations based on… Show more

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Cited by 7 publications
(1 citation statement)
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“…Thus, there is a significant tendency for ceramic plates to decrease the thickness to reduce energy consumption and improve the utilization rate of mineral raw materials [3,4]. Consequently, the thickness of large-sized thin architectural ceramic plates is only 3-5 mm, which is 50-85% thinner and 40-53% lower in energy consumption compared to 10-20 mm thick traditional ceramic plates [5][6][7]. Nevertheless, the mechanical properties of large-sized ceramic plates decline dramatically with the thickness decrease, resulting in high breakage rates by brittle fracture under external loads caused by high bounding energy because the covalent bond has difficulties in slipping and deforming [8][9][10].…”
Section: Introductionmentioning
confidence: 99%
“…Thus, there is a significant tendency for ceramic plates to decrease the thickness to reduce energy consumption and improve the utilization rate of mineral raw materials [3,4]. Consequently, the thickness of large-sized thin architectural ceramic plates is only 3-5 mm, which is 50-85% thinner and 40-53% lower in energy consumption compared to 10-20 mm thick traditional ceramic plates [5][6][7]. Nevertheless, the mechanical properties of large-sized ceramic plates decline dramatically with the thickness decrease, resulting in high breakage rates by brittle fracture under external loads caused by high bounding energy because the covalent bond has difficulties in slipping and deforming [8][9][10].…”
Section: Introductionmentioning
confidence: 99%