Existing thermal management methods for electronics do not meet technology needs and remain a major bottleneck in the evolution of computing, sensing, and information technology. The decreasing size of microelectronics components and the resulting increasing thermal output density require novel cooling solutions. Electrohydrodynamic ionic wind pumps, also known as electrostatic fluid accelerators (EFA), have the potential of becoming a critical element of electronic thermal management solutions. In order to take full advantage of EFA-based thermal management, it is essential to miniaturize EFA technology. This paper demonstrates the successful operation of a meso-scale microfabricated silicon EFA. A cantilever structure fabricated in bulk silicon with a radius of tip curvature of 25 μm is used as the corona electrode. The device was fabricated using a Deep Reactive Ion Etching (DRIE) microfabrication process. Forced convection cooling is demonstrated using infrared imaging, showing a 25°C surface temperature reduction over an actively heated substrate. The fabrication and test results of a meso-scale microfabricated EFA are presented in this paper.