Dual-functional thermal management materials for highly thermal conduction and effectively heat generation

Wang, Zhiguo; Jin, Yi-Fei; Hong, Rui; Du, Jiguang; Dai, Kun; Ge, Zheng; Gao, Jiefeng; Xu, Ling; Xu, Jia‐Zhuang; Li, Zhong‐Ming

doi:10.1016/j.compositesb.2022.110084

Cited by 45 publications

(17 citation statements)

References 58 publications

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“…The principle of a Joule heater is that when a driving voltage is applied to the conductor the inelastic collision of electrons in the conductor accelerates to generate Joule heat, which increases the temperature of the conductor. 45 For the APU/CNT foam with a fixed dimension of ∼15 × 20 × 5 mm, its saturation temperature (T s ) recorded by an infrared thermal imaging camera gradually increased with increasing the driving voltage as reported in some previous works, 46 (Figure 5a). Moreover, the temperature curves of the APU/ CNT foam can be stably switched between ∼40 and ∼80 °C under alternating voltages of 2 and 4 V during several cycles (Figure 5c), and the T s value of the APU/CNT foam can also be stabilized at around ∼80 °C (4 V) for a long time of 25 min (Figure 5d), which suggested that the APU/CNT foam has outstanding recyclability and long-term durability as a Joule heater.…”

supporting

confidence: 77%

A Proof-of-Concept Study of Auxetic Composite Foams with Negative Poisson’s Ratio for Enhanced Strain-Stable Performance of Electromagnetic Shielding

Chen

Shen

et al. 2023

ACS Materials Lett.

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Stretching of conductive polymer composite (CPC) foams always results in a severe reduction in electromagnetic interference shielding effectiveness (EMI SE) mainly due to the destruction of conductive networks and the decrement of sample thickness. Therefore, it is desirable to develop a novel strategy for preparing CPC foams with strain-stable EMI SE under moderate stretching. Herein, a strategy of constructing an auxetic structure to stabilize the EMI SE of CPC foams during stretching is proposed for the first time. Lightweight auxetic polyurethane/carbon nanotube (APU/CNT) composite foams were prepared by a solution dip-coating approach and triaxial volumetric compression. Compared with nonauxetic PU/CNT foam, the APU/CNT foam with similar filler loading and density of around 0.035 g/cm3 showed more stable SE values with the increase of tensile strain (especially within the first 20% strain, the SE/SE0 reduction of the APU/CNT foam is less than ∼5%), exhibiting enhanced strain-stable EMI-shielding behavior in the stretching process. The underlying reason is that the presence of auxetic structure with a negative Poisson’s ratio could not only slightly increase the thickness of the foam but also avoid the serious destruction of the conductive networks under stretching, which is beneficial to attenuate EM waves more stably. Moreover, the outstanding and more stable Joule-heating performance could also be observed in the stretched APU/CNT foam. This work reveals the potential of auxetic structures to solve the challenging problem of how to stabilize the EMI-shielding (or Joule-heating) performance of CPC foams during moderate stretching.

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supporting

confidence: 77%

A Proof-of-Concept Study of Auxetic Composite Foams with Negative Poisson’s Ratio for Enhanced Strain-Stable Performance of Electromagnetic Shielding

Chen

Shen

et al. 2023

ACS Materials Lett.

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“…3b and Table S2) [28][29][30][31][32][33][34][35][36][37][38][39][40], at a simultaneously high in-plane thermal conductivity of 20.3 W m −1 K −1 . The different inflection points of thermal conductivity in the through-plane and in-plane directions stem from the different film volume shrinkage after solvent exchange and ambient drying process, which affect the construction of complete thermal conductive pathway in two directions [41][42][43]. Further comparison through the specific thermal conductivity (STC = TC/filler loading) demonstrates that our polymer/s-BN composite film presents a value of 0.85, which is also obviously greater than those of the previously reported BNbased composites.…”

Section: Thermal Performance Of Polymer/s-bn Composite Filmsmentioning

confidence: 99%

Self-Modifying Nanointerface Driving Ultrahigh Bidirectional Thermal Conductivity Boron Nitride-Based Composite Flexible Films

Huang

Zhang

et al. 2022

Nano-Micro Lett.

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While boron nitride (BN) is widely recognized as the most promising thermally conductive filler for rapidly developing high-power electronic devices due to its excellent thermal conductivity and dielectric properties, a great challenge is the poor vertical thermal conductivity when embedded in composites owing to the poor interfacial interaction causing severe phonon scattering. Here, we report a novel surface modification strategy called the “self-modified nanointerface” using BN nanocrystals (BNNCs) to efficiently link the interface between BN and the polymer matrix. Combining with ice-press assembly method, an only 25 wt% BN-embedded composite film can not only possess an in-plane thermal conductivity of 20.3 W m−1 K−1 but also, more importantly, achieve a through-plane thermal conductivity as high as 21.3 W m−1 K−1, which is more than twice the reported maximum due to the ideal phonon spectrum matching between BNNCs and BN fillers, the strong interaction between the self-modified fillers and polymer matrix, as well as ladder-structured BN skeleton. The excellent thermal conductivity has been verified by theoretical calculations and the heat dissipation of a CPU. This study provides an innovative design principle to tailor composite interfaces and opens up a new path to develop high-performance composites.

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“…[ 61 ] The arrangement orientation of BNNSs@Al 2 O 3 in the polymer matrix has a substantial impact on the development of the thermal conductive pathways and the efficiency of directional TC. [ 62 ]…”

Section: Resultsmentioning

confidence: 99%

Improvement of “point‐plane”‐like hetero‐structured fillers on thermal conductivity of poly(vinyl alcohol) composites

Zhang

2023

Polymer Composites

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With the rapid growth of highly integrated electrical devices, the urgent demand for polymer composites with high thermal conductivity (TC) is increasing for effective thermal management. In this work, boron nitride nanosheets (BNNSs) were chemically grafted with aluminum oxide (Al2O3) to develop hetero‐structured filler (BNNSs@Al2O3). The BNNSs@Al2O3 fillers were uniformly dispersed in the poly(vinyl alcohol) (PVA) by solvent mixing, verified by SEM, and the oriented BNNSs@Al2O3/PVA composites were produced by the doctor blade method. The results exhibited that the synergistic effect of BNNSs and Al2O3 was achieved, and the thermal conductivities of BNNSs@Al2O3/PVA composites were improved. When keeping the filler content at 30 wt%, the in‐plane and out‐of‐plane TC of BNNSs@Al2O3/PVA composite reached 5.641 and 0.651 W/(m·K), respectively. The BNNSs@Al2O3 filler may improve the performance of composite heat dissipation by reducing the interfacial resistance between fillers and making it easier to establish directed heat‐transfer pathways. This composite demonstrates promising application in the field of electronic packaging.

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Dual-functional thermal management materials for highly thermal conduction and effectively heat generation

Cited by 45 publications

References 58 publications

A Proof-of-Concept Study of Auxetic Composite Foams with Negative Poisson’s Ratio for Enhanced Strain-Stable Performance of Electromagnetic Shielding

A Proof-of-Concept Study of Auxetic Composite Foams with Negative Poisson’s Ratio for Enhanced Strain-Stable Performance of Electromagnetic Shielding

Self-Modifying Nanointerface Driving Ultrahigh Bidirectional Thermal Conductivity Boron Nitride-Based Composite Flexible Films

Improvement of “point‐plane”‐like hetero‐structured fillers on thermal conductivity of poly(vinyl alcohol) composites

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