Dual laser beam revising the separation path technology of laser induced thermal-crack propagation for asymmetric linear cutting glass

Zhao, Chunyang; Zhang, Hongzhi; Yang, Lijun; Wang, Yang; Ding, Yongkun

doi:10.1016/j.ijmachtools.2016.04.005

Cited by 35 publications

(6 citation statements)

References 17 publications

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“…This speculation reproduces in the simulation of curve cutting glass as shown in Figure 14. From the temperature distribution contours in Figure 14a, it indicates that the maximum temperature in microwave cutting glass is about 140 °C, which is lower than the temperature value in laser cutting glass based on TCFM reported by Zhao [9]. Figure 14b shows simulation results of the stress distribution in curved-cracking of glass.…”

Section: Crack-propagation Mechanism Of Middle and End Stagementioning

confidence: 80%

“…Frist, s r curve is obtained by stress calculation or simulation; then, the corresponding curve Lc can be fitted using some discrete points calculated by Equation (9). Finally, the D 1 , D 2 is obtained by the above methods, and the Y 1 is achieved.…”

Section: Prediction Of the Unstable Crack-propagation In Initial Stagementioning

confidence: 99%

“…This always needs some subsequent breaking process. Then, some scholars found that laser with wavelength of 1064 nm could penetrate a certain thickness of glass to form a full-body cutting mode, and the priority of this cutting mode has been demonstrated [7][8][9].…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Mechanism of irregular crack-propagation in thermal controlled fracture of ceramics induced by microwave

Cheng

Zhao

Wang

et al. 2020

Mechanics & Industry

Self Cite

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Microwave cutting glass and ceramics based on thermal controlled fracture method has gained much attention recently for its advantages in lower energy-consumption and higher efficiency than conventional processing method. However, the irregular crack-propagation is problematic in this procedure, which hinders the industrial application of this advanced technology. In this study, the irregular crack-propagation is summarized as the unstable propagation in the initial stage, the deviated propagation in the middle stage, and the non-penetrating propagation in the end segment based on experimental work. Method for predicting the unstable propagation in the initial stage has been developed by combining analytical models with thermal-fracture simulation. Experimental results show good agreement with the prediction results, and the relative deviation between them can be <5% in cutting of some ceramics. The mechanism of deviated propagation and the non-penetrating propagation have been revealed by simulation and theoretical analysis. Since this study provides effective methods to predict unstable crack-propagation in the initial stage and understand the irregular propagation mechanism in the whole crack-propagation stage in microwave cutting ceramics, it is of great significance to the industrial application of thermal controlled fracture method for cutting ceramic materials using microwave.

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Section: Crack-propagation Mechanism Of Middle and End Stagementioning

confidence: 80%

Section: Prediction Of the Unstable Crack-propagation In Initial Stagementioning

confidence: 99%

See 1 more Smart Citation

Mechanism of irregular crack-propagation in thermal controlled fracture of ceramics induced by microwave

Cheng

Zhao

Wang

et al. 2020

Mechanics & Industry

Self Cite

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“…As an efficient machining method [1] , laser machining is widely used in the current manufacturing industry. Laser machining can be mainly divided into two kinds, one is laser melting cutting material [2] , and the other is laser thermal cracking method [3] .…”

Section: Introductionmentioning

confidence: 99%

“…The former has high laser power, the material absorbs laser energy and instantly has a high temperature rise, and the material reaches the boiling point, melting or vaporization occurs. The latter has low laser power, and the material does not reach the boiling point, but a high temperature gradient is formed inside the material, resulting in a large thermal stress [1] , When the thermal stress exceeds the strength limit of the material, cracking will occur [4] , and the extension direction of this crack follows the travel direction of the laser, which makes it possible for thermal crack to control the machining shape [1] . With the progress of nanotechnology, the machining scale of laser is required to be more precise [5] , and thermal cracking machining has smaller machining accuracy, which is more suitable for precision machining [6] .…”

Section: Introductionmentioning

confidence: 99%

Fabrication of regular micro crack array on the surface of hard brittle material with 46.9nm soft x-ray laser

Liao

Cui

2022

Sixth International Symposium on Laser Interaction With Matter

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The precision machining of hard and brittle materials has always been a research frontier and difficult problem in the industry. In this paper, it is verified theoretically and experimentally that 46.9nm soft X-ray laser can produce regular microcrack arrays on the surface of hard and brittle materials. Taking BaF2 and SiO2 materials as examples, based on the multiphysical field coupling numerical simulation method, the evolution process of temperature and stress, as well as the results of maximum stress section and strain are obtained, which can be used to predict the damage of hard and brittle materials processed by laser thermal cracking. The simulation results show that the maximum stress and strain of BaF2 have exceeded the strength limit, while the maximum stress and strain of SiO2 are less than the strength limit. The experiment shows the same result, that is, BaF2 has fracture failure while SiO2 has no fracture failure. The simulation and experimental results are the same, showing that the 46.9nm soft X-ray laser can be used for precision thermal cracking of hard and brittle materials.

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A simple method for predicting the machinability in microwave cutting ceramics with microwave-induced thermal-crack propagation

Zhao

Cheng

Wang

et al. 2020

Int J Adv Manuf Technol

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Dual laser beam revising the separation path technology of laser induced thermal-crack propagation for asymmetric linear cutting glass

Cited by 35 publications

References 17 publications

Mechanism of irregular crack-propagation in thermal controlled fracture of ceramics induced by microwave

Mechanism of irregular crack-propagation in thermal controlled fracture of ceramics induced by microwave

Fabrication of regular micro crack array on the surface of hard brittle material with 46.9nm soft x-ray laser

A simple method for predicting the machinability in microwave cutting ceramics with microwave-induced thermal-crack propagation

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