Durability of Pb-Free Solder Connection between Copper Interconnect Wire and Crystalline Silicon Solar Cells — Experimental Approach

Cuddalorepatta, Gayatri; Dasgupta, Abhijit; Sealing, Scott; Moyer, J.; Tolliver, Todd; Loman, James

doi:10.1109/isapm.2006.1665978

Cited by 5 publications

(6 citation statements)

References 4 publications

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“…Failure mechanism and life prediction of solder interconnection have been studied for semiconductor packages [1,2]. However the solder interconnection for PV needs to be studied to obtain information about field failure modes, stress factors, and mechanisms, thus allowing long term life prediction [3,4]. This study focuses on the failure mechanisms of solder interconnection for a c-Si PV Module.…”

Section: Introductionmentioning

confidence: 99%

Field failure mechanism study of solder interconnection for crystalline silicon photovoltaic module

Jeong

Park

Han

2012

Microelectronics Reliability

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Section: Introductionmentioning

confidence: 99%

Field failure mechanism study of solder interconnection for crystalline silicon photovoltaic module

Jeong

Park

Han

2012

Microelectronics Reliability

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“…A US PV module manufacturer (ASE Americas) has used Pb-free solder in the modules since 1993 and independent reliability studies carried out at Arizona State University and Florida Solar Energy Center have shown that 96.5%Sn/3.5%Ag solder is at least as reliable as standard lead-containing solder [26]. In a comparative study of interconnects containing Pb-free (Sn3.5Ag) and standard (Sn36Pb2Ag) solders, Cuddalorepatta et al have found that the void density from pre-test scanning electron microscopy (SEM) image analysis was 19% and 39% for Sn36Pb2Ag and Sn3.5Ag solders respectively [28]. This was attributed to lower wettability of Pb-free solder.…”

Section: Impact Of Lead-containing and Lead-free Soldersmentioning

confidence: 99%

Manufacturing metrology for c-Si module reliability and durability Part III: Module manufacturing

Davis

Rodgers

Scardera

et al. 2016

Renewable and Sustainable Energy Reviews

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This article is the third and final article in a series dedicated to reviewing each process step in crystalline silicon (c-Si) photovoltaic (PV) module manufacturing process: feedstock, crystallization and wafering, cell fabrication, and module manufacturing. The goal of these papers is to identify relevant metrology techniques that can be utilized to improve the quality and durability of the final product. The focus of this article is on the module manufacturing process. The c-Si PV module fabrication process can be divided into three primary areas; (1) stringing and tabbing, (2) lamination, and (3) integration of junction box and bypass diode(s). Each of these processing steps can impact the reliability and durability of PV modules in the field. The ultimate goal of this article is to identify appropriate metrology techniques and characterization methods that can be utilized within a module manufacturing facility to improve the reliability and durability of the final product. Additionally, a gap analysis is carried out to identify areas in need of further research and a discussion is provided that addresses new challenges for advanced materials and emerging technologies.

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“…The solar array fill factor decreases and the point of maximum power moves toward lower voltages. An experimental evaluation of the relation between solar array series resistance and thermal cycles is found in [22], in which results are given for 1000 cycles between 40 and 80 C and 20-min dwell time. This experimental setup reproduces the sun/ eclipse times in orbit fairly closely, neglecting low-amplitude thermal cycles due to attitude motion.…”

Section: B Low-efficiency Triple-junction Solar Arraysmentioning

confidence: 99%

Analysis of the UNISAT-3 Solar Array In-Orbit Performance

Santoni

Piergentili

2008

Journal of Spacecraft and Rockets

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A technological experiment to assess the in-orbit performance of non-space-rated solar arrays is onboard the microsatellite UNISAT-3. These include terrestrial-technology monocrystalline silicon and low-efficiency triplejunction solar arrays, assembled using commercial off-the-shelf materials and following conventional non-spacerated procedures. A space-rated monocrystalline silicon solar array is also onboard, used for comparison of the achieved results. The manufacturing process is described and the solar array performance is evaluated based on the data collected in the first two-and-a-half years of operation in orbit. For both terrestrial-technology and lowefficiency triple-junction solar arrays, the observed solar array degradation is very fast in the first half-year, in which approximately one-fourth of the initial efficiency is lost. Then degradation stabilizes, showing a long-term decaying rate with a time constant of ten years, which makes the suggested technology suitable for small scientific and educational low-Earth-orbit spacecraft.

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Durability of Pb-Free Solder Connection between Copper Interconnect Wire and Crystalline Silicon Solar Cells — Experimental Approach

Cited by 5 publications

References 4 publications

Field failure mechanism study of solder interconnection for crystalline silicon photovoltaic module

Field failure mechanism study of solder interconnection for crystalline silicon photovoltaic module

Manufacturing metrology for c-Si module reliability and durability Part III: Module manufacturing

Analysis of the UNISAT-3 Solar Array In-Orbit Performance

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