Durability of Silicone Electrically Conductive Adhesive in Metal Wrap-through Module

Beaucarne, G.; Zambova, Adriana; Broek, K.M.; Albaugh, John; Chislea, Brian; Wei, Jason; Meerendré, Thibault Kervyn de; Kloos, Mario; Bennett, I.J.

doi:10.1016/j.egypro.2013.07.307

Cited by 5 publications

(2 citation statements)

References 2 publications

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“…The cure chemistry of the material is designed such that the material cures during a typical module lamination cycle at 150 °C for several minutes. Common to other silicone ECAs [2], the material is flexible throughout the PV module operating temperature range (-20°C to 80°C), with a shear storage modulus G' below 2 ×10 7 Pa throughout the range. The specific contact resistance between the ECA and OSP-finished Cu is calculated from TLM measurements to be much lower than 500 μΩ cm 2 (estimation -there is uncertainty due to the asymmetry of the contact structure used).…”

Section: Results On Osp-finished Conductive Backsheetsmentioning

confidence: 99%

Study of Compatibility of Silicone-based Electrically Conductive Adhesives and Conductive Backsheets for MWT Modules

Beaucarne¹,

Broek

Chislea

et al. 2014

Energy Procedia

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Section: Results On Osp-finished Conductive Backsheetsmentioning

confidence: 99%

Study of Compatibility of Silicone-based Electrically Conductive Adhesives and Conductive Backsheets for MWT Modules

Beaucarne¹,

Broek

Chislea

et al. 2014

Energy Procedia

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“…Apart from that, silicone are high value polymers that contain a Si-O-Si-O chain rather than of C-chain. The larger Si-O bond energy (~110 kcal/mol) compared with C bond (~80 kcal/mol) provides superior stability and durability against ultraviolet light and high temperatures [3]. Although they have excellent mechanical characteristics, the electrical efficiency of silicone-based ECAs is limited thus prevents their prevalent usage in electronic industry.…”

Section: Introductionmentioning

confidence: 99%

Electrical and Mechanical Properties of Silicone Electrical Conductive Adhesives (ECAs) Filled Carbon Black Treated with 3-Aminotriethoxysilane at Elevated Temperature

Hasnol

Ahmad²,

Sarip³

et al. 2022

IJIE

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In this study, different formulation of silicone filled carbon black electric conducting adhesive (ECAs) were successfully fabricated. Carbon black (CB) was treated with 3-aminotriethoxysilane to improve the surface adhesion by grafting of amide functional groups on the surface of the CB. Various loading of untreated and treated CB (0%,5%,10% and 15%) on silicone ECAs using film casting method were prepared and characterized. The characterization was performed on the conductive adhesive film by using Fourier Transform Infrared Spectroscopy (FTIR), hardness and tensile testing. While for the electrical property, electrochemical impedance spectroscopy (EIS) was investigated. The FTIR spectrums confirmed the surface modification of CB with 3-aminotriethoxysilane and amide functional groups was presence at 1549 cm-1, 1250.7 cm-1, 1126.6 cm-1,976.16 cm-1and 860.02 cm-1corresponding to the N-H, SiO-H, Si-O-Si, C-N and C=C stretching vibrations of the amino groups (-R-NH3+) respectively. The conductivity of the ECAs was dependent on the CB loadings. As the CB loading increased, the conductivity of adhesive conductive film was increased up to 10% of CB loading and decreased when at 15% of CB loading. This is due to the gap distance of interparticle of silicone and CB is high. Whilst the tensile strength of the silicone filled CB increased with increasing of CB content both untreated and treated CB at 0.05954 MPa and 3.3027 MPa respectively. This is supported by hardness testing also showed the same trend with increment of CB loading, the hardness value also increased. The optimum value was found at 42 and 54 for untreated and treated CB respectively. The optimum formulation of electric conductivity was found at 10% loading of CB at 1.75E-08 /cm. The conductivity of ECAs filled CB at elevated temperature exhibits increment trend of untreated/treated CB at temperature of 100 °C to 160 °C however decreased at 180 °C. It is believed that with increasing the temperature, the interparticle average distance increase due to the difference in the thermal expansion of silicone and carbon black. The utilization of treated CB in silicone ECAs improved the conductivity and mechanical properties giving way to a full potential of using CB as filler.

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Materials Challenge for Shingled Cells Interconnection

Beaucarne¹

2016

Energy Procedia

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Durability of Silicone Electrically Conductive Adhesive in Metal Wrap-through Module

Cited by 5 publications

References 2 publications

Study of Compatibility of Silicone-based Electrically Conductive Adhesives and Conductive Backsheets for MWT Modules

Study of Compatibility of Silicone-based Electrically Conductive Adhesives and Conductive Backsheets for MWT Modules

Electrical and Mechanical Properties of Silicone Electrical Conductive Adhesives (ECAs) Filled Carbon Black Treated with 3-Aminotriethoxysilane at Elevated Temperature

Materials Challenge for Shingled Cells Interconnection

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