Dynamic analysis and structure optimization on trapezoidal wave generator for eliminating the over deviation of the residual wave in shock test measurement

Wen, Jingjing; Yao, Houpu; Wu, Bin; Ji, Ze; Wen, Longyin; Xu, Man Man; Jin, Yi; Yan, Xunliang

doi:10.1016/j.measurement.2021.109665

Cited by 5 publications

(1 citation statement)

References 24 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Accordingly, a process with the following conditions A solder joints loop was implemented using a daisy-chain design. To determine the failure and monitor the damage level, the resistance of the solder joint loop was considered as the failure criteria [33], [34]. A 10% increase of the electrical resistance was considered as the failure criteria provided that five consecutive tests confirm the results [35].…”

Section: B Experimental Drop Test Proceduresmentioning

confidence: 99%

Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach

et al. 2022

View full text Add to dashboard Cite

Rapid and precise reliability evaluation of electronic circuits plays a key role in the design stage of the electronic systems. The task becomes even more difficult when several major parameters contribute into the reliability evaluation. This paper proposes a neural network aided approach as a prediction tool for estimating the useful lifetime of the ball shaped solder joint as the most resistless part under accidental drops in the electronic devices. Several contributory factors including ball grid array (BGA) chip location, printed circuit board (PCB) thickness, solder alloy composition and solder ball volume are considered in our proposed rapid prediction model and their effects are investigated. 480 finite element simulations as well as 20 experimental tests are performed to obtain an enriched database for our neural network based prediction model. The accuracy of the proposed model is calculated as 97.55% in comparison with the finite element and the experimental results. Ability of considering multi contributory factors in the reliability evaluation of the BGA chip makes our proposed approach be a suitable candidate in design for reliability of the electronic systems.INDEX TERMS Solder joint, drop test, lifetime estimation, machine learning.

show abstract

Section: B Experimental Drop Test Proceduresmentioning

confidence: 99%