2012 IEEE International Conference on Industrial Technology 2012
DOI: 10.1109/icit.2012.6209994
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Dynamic analysis of an SOI based CMUT

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Cited by 8 publications
(1 citation statement)
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“…Silicon nitride or silicon dioxide are commonly used to realize the dielectric spacer in a CMUT structure. However, both silicon nitride and silicon dioxide suffer from high ionic contamination, trapped charges, and wafer bow or cracking during the high temperature annealing process that eventually degrades the transduction efficiency and leads to device failure [ 10 ]. The process of silicon oxidation to grow silicon dioxide introduces trapped charges in the Si-SiO 2 interface due to the interruption of the silicon periodic lattice structure at the Si-SiO 2 interface [ 11 ].…”
Section: Introductionmentioning
confidence: 99%
“…Silicon nitride or silicon dioxide are commonly used to realize the dielectric spacer in a CMUT structure. However, both silicon nitride and silicon dioxide suffer from high ionic contamination, trapped charges, and wafer bow or cracking during the high temperature annealing process that eventually degrades the transduction efficiency and leads to device failure [ 10 ]. The process of silicon oxidation to grow silicon dioxide introduces trapped charges in the Si-SiO 2 interface due to the interruption of the silicon periodic lattice structure at the Si-SiO 2 interface [ 11 ].…”
Section: Introductionmentioning
confidence: 99%