Dynamic characteristics of printed circuit assembly under the influence of temperature

Кочегаров, И. И.; Tankov, G. V.; Danilova, Evgeniya

doi:10.1109/scm.2016.7519706

Cited by 10 publications

(3 citation statements)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…To determine the sensitivity coefficient of material, the method described in [2], [5]- [7] can be applied. In some cases, due to the lack of data for the sensitivity coefficient of the material, for new types of foils of PCBs in particular, the theoretical concentration factor can be used.…”

Section: Stress Concentration Modelmentioning

confidence: 99%

See 1 more Smart Citation

Models of Printed Circuit Boards Conductive Pattern Defects

Danilova

Кочегаров

Yurkov

et al. 2018

Applied Computer Systems

Self Cite

View full text Add to dashboard Cite

A number of PCB defects, though having passed successfully the defect identification procedure, can potentially grow into critical defects under the influence of various external and (or) internal influences. The complex nature of the development of defects leading to PCB failures demands developing and updating the data measuring systems not only for detection but also for the prediction of future development of PCB defects considering the external influences. To solve this problem, it is necessary to analyse the models of defect development, which will allow predicting the defect growth and working out the mathematical models for their studies. The study uses the methods of system analysis, theory of mathematical and imitation modelling, analysis of technological systems. The article presents four models for determining the theoretical stress concentration factor for several types of common defects, considering the strength loss of PCB elements. For each model the evaluation of parameters determining its quality is also given. The formulas are given that link the geometry of defects and the stress concentration factor, corresponding to four types of defects. These formulas are necessary for determining the number of cycles and time to failure, fatigue strength coefficient. The chosen models for determining the values of the stress concentration factor can be used as a database for identifying PCB defects. The proposed models are used for software implementation of the optical image inspection systems.

show abstract

Section: Stress Concentration Modelmentioning

confidence: 99%

“…To choose the type of correlation, with the closest approximation to the data in the form of experimental graphs, the dependency is approximated using the following models [7], [9]- [11]:…”

Section: Stress Concentration Modelmentioning

confidence: 99%

Models of Printed Circuit Boards Conductive Pattern Defects

Danilova

Кочегаров

Yurkov

et al. 2018

Applied Computer Systems

Self Cite

View full text Add to dashboard Cite

show abstract

“…which, being complemented by the boundary and initial conditions, forms a clear difference scheme, giving the calculated rod model in conjunction with the geometric model, which is simply realised by a computer. The degree of information reliability obtained in discrete models must be confirmed by the research materials of models after their design and construction of algorithms [12]- [15].…”

mentioning

confidence: 99%

Discrete Models in Research of Wave Processes in Rod Structures of Radio-Electronic Means

Лысенко

Yurkov

Trusov

et al. 2018

Applied Computer Systems

View full text Add to dashboard Cite

The article shows the relevance of the application of discrete models of rod structures of radio-electronic means (REM) for the study of their behaviour under transient loading. A discrete model of the propagation of harmonic waves in the rod and the study of standing waves are proposed. Computational experiments using the proposed model are conducted. The results show that the model accurately reflects qualitative dynamics of the physical processes in the elastic rod while the waves of elastic deformations are passing through. The proposed models are used for software implementations of systems of mechanical simulation of the behaviour of rod structures.

show abstract