2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) 2017
DOI: 10.1109/dtip.2017.7984472
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Dynamic characterization of an electrothermal actuator devoted to discrete MEMS positioning

Abstract: This paper focuses on the dynamic characterization of an electrothermal actuator devoted to discrete MEMS positioning. Based on U-shape structure, such actuator has been employed in several MEMS applications where fine and repeatable positioning is required. The studied electrothermal actuator here is microfabricated on a doped SOI substrate and its dynamic response, during heating and cooling cycles, is recorded using precise and high-speed camera. To explain its dynamic behavior, FEM simulations, using Comso… Show more

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Cited by 10 publications
(4 citation statements)
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“…The whole module comprises three subsystems that guarantee the switching, the holding, and the guiding of its moving part. Each subsystem consists of flexible structures actuated by two U-shaped actuators [18]. Each actuator can provide respectively a displacement of 200 µm and a force higher than 10 mN, which are largely sufficient to actuate the multistatble and the whole robot.…”
Section: B Multistable Modulementioning
confidence: 99%
“…The whole module comprises three subsystems that guarantee the switching, the holding, and the guiding of its moving part. Each subsystem consists of flexible structures actuated by two U-shaped actuators [18]. Each actuator can provide respectively a displacement of 200 µm and a force higher than 10 mN, which are largely sufficient to actuate the multistatble and the whole robot.…”
Section: B Multistable Modulementioning
confidence: 99%
“…The U-shaped actuator is fabricated by DRIE technology [25,26]. DRIE technology [23,24] is applied to the fabrication of the Si-based actuator.…”
Section: Experimental Validationmentioning
confidence: 99%
“…Before the fabrication, the sample (Si) is < 100 > oriented and heavily doped n-type single-crystal silicon wafer, with an electrical resistivity of about 0.04 ohm•cm. Deep reactiveion etch echnology [23,24], in which bonding, etching, and deposition are included, is applied to the fabrication of the Sibased actuator. The experimental setup including the power supply, microscope, camera, and computer, is shown in figure 10.…”
Section: Fem and Experimental Verificationmentioning
confidence: 99%