Dynamic Compact Thermal Model for stacked-die components

Monier-Vinard, Eric; Dia, Cheikh Tidiane; Bissuel, Valentin; Laraqi, Najib; Daniel, Olivier

doi:10.1109/stherm.2012.6188821

Cited by 10 publications

(5 citation statements)

References 5 publications

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“…Although the model was seen to provide a useful initial guess of the maximal IC temperature at the steady state [12], the results were not very accurate across the array, and the transient phenomena was not considered. It is worth to note that several dynamic thermal modeling techniques were also proposed in the literature [30], [31], yet there is no universal methodology as the ones for the static models [32], [33]. Besides, the thermal and EM simulations in the heatsink antenna literature are not coupled.…”

Section: B Thermal Modeling and Multiphysics Optimizationmentioning

confidence: 99%

Opportunities, Progress and Challenges in Active Heatsink Antenna Arrays for 5G and Beyond

Aslan

2022

2022 52nd European Microwave Conference (EuMC)

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The conventional air and liquid cooling based thermal management strategies in mm-wave active phased arrays are illustrated with several examples from the literature. The key role of antenna engineers in electronics thermal management is discussed. The intriguing concept of using the antennas as auxiliary heat dissipators is recapitulated with a focus on the past and recent developments. The multiphysics (electromagnetic and thermal) modeling and design approaches of such dual function antennas are outlined. Some of the future multidisciplinary research challenges in heatsink antennas are identified.

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Section: B Thermal Modeling and Multiphysics Optimizationmentioning

confidence: 99%

Opportunities, Progress and Challenges in Active Heatsink Antenna Arrays for 5G and Beyond

Aslan

2022

2022 52nd European Microwave Conference (EuMC)

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“…Unfortunately, Delphi's method focused only on the creation of steady-state one-source thermal network and the generation of Dynamical Compact Thermal Model (DCTM) remains a problematic [11]. To resolve that issue, some studies were done [12] [13] and then an in-house procedure established.…”

Section: Concurrent Model Reduction Approachesmentioning

confidence: 99%

“…The added steps are discussed in [10,14,23]. As mentioned, the steps for the identification of the thermal capacities are given in [12,13].…”

Section: Dynamical Compact Thermal Modelsmentioning

confidence: 99%

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Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization

Rogié

Codecasa

Monier-Vinard

et al. 2018

Microelectronics Reliability

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Delphi-like boundary condition independent (BCI) compact thermal models (CTMs) are the standard for modelling single die packages. However their extraction, particularly in the transient case, will be time consuming due to complex numerical simulations for a large number of external conditions. Lately, new approaches to extract a BCI dynamical CTM (DCTM), based on model order reduction (MOR) were developed. Despite the numerous advantages of this recent method, the lack of numerical tools to integrate reduced-order models (ROM) makes it difficult to use at board level. In this study, a novel process flow for extracting Delphi-inspired BCI DCTMs is proposed. Thus a detailed three-dimensional model is replaced by a BCI-ROM model using FANTASTIC matrix reduction code to generate the data used in the creation of a Delphi-style BCI DCTM. That hybrid reduction method has been applied, at first on a single-chip package (QFN16) then on a dual-chip package (DFN12). Their derived CTM and DCTM have been compared in term of accuracy and creation time using, or not, MOR reduction technique. The results show that for a similar accuracy, the integration of MOR technique allows minimizing the time-consuming numerical simulations and consequently reduce the thermal network creation time by 80%.

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“…is introduced. As a result, the nonlinear heat diffusion problem (1)-(3) is reformulated by (3) and 14- (17) in the following. The thermal model is still defined by (4) and (5).…”

Section: Reformulation Of the Nonlinear Heat Diffusion Problemmentioning

confidence: 99%

Compact Dynamic Modeling for Fast Simulation of Nonlinear Heat Conduction in Ultra-Thin Chip Stacking Technology

Codecasa

d’Alessandro

Magnani

et al. 2014

IEEE Trans. Compon., Packag. Manufact. Technol.

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A novel nonlinear model order reduction method is proposed for constructing one-port dynamic compact models of nonlinear heat diffusion problems for ultra-thin chip stacking technology. The method leads to models of small state-space dimensions, which allow accurately reconstructing the whole time evolution of the temperature field due to an arbitrary power waveform of practical interest. The approach is also efficient, since the computational time/memory requirements for constructing each dynamic compact model is about one order of magnitude lower than that corresponding to a single 3-D finite element method transient simulation of a nonlinear problem. Index Terms-Dynamic compact thermal model (DCTM), nonlinear model order reduction (MOR), self-heating, thermal impedance, ultra-thin chip stacking (UTCS).

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Dynamic Compact Thermal Model for stacked-die components

Cited by 10 publications

References 5 publications

Opportunities, Progress and Challenges in Active Heatsink Antenna Arrays for 5G and Beyond

Opportunities, Progress and Challenges in Active Heatsink Antenna Arrays for 5G and Beyond

Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization

Compact Dynamic Modeling for Fast Simulation of Nonlinear Heat Conduction in Ultra-Thin Chip Stacking Technology

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