“…However, the inability to follow the Dennard supply voltage has lead to high chip heat flux dissipation densities, especially during the last decade [2]. As a consequence, electronic reliability considerations are driving a shift away from air-cooling [3] towards a number of alternative approaches including liquid cooling [4,5], two-phase cooling [6,7], phase change materials (PCM) [8,9] and nanofluids [10,11]. Single-phase liquid cooling has long been identified as an effective and feasible approach for cooling high heat flux density chips.…”