“…Under transient electromechanical loading, severe mechanical stress occurs during operation. Therefore, many authors studied the dynamic fracture of piezoelectric materials to understand their electromechanical behaviors under different time-dependent loads (Ang and Athanasius, 2011;Enderlein et al, 2005;Feng et al, 2006;Garcia-Sanchu et al, 2008;Li and Lee, 2006;Liu and Zhong, 2010;Nishioka et al, 2003;Rojas-Diaz et al, 2011;Saez et al, 2006;Ueda, 2003;Wunsche et al, 2011;Zhao, 2004). For practical applications, the crack and the medium are always of finite size.…”