Dynamic Scaling in Recrystallization of an Electrochemically Roughened Silver Electrode Surface in Water

Abstract

We have studied the kinetic mechanisms in recrystallization of an electrochemically roughened silver electrode surface in Ar-saturated water at room temperature using dynamic scaling theory and tapping mode atomic force microscopy (TMAFM). We observed dynamic scaling behavior during the recrystallization. The roughness (α) and growth (β) exponents measured were α = 0.95 ± 0.05 and β = 0.16±0.04 for the scale length (L) < the average diameter of Ag nodules (d), and α = 0.61±0.05 and β = 0.20±0.05 for L > d. These scaling exponents are relatively close to the predictions (β = 0.25, 0.20) of conservative models where surface diffusion is the main mechanism of mass transport in determining a growing surface morphology.