Dynamic templating: a large area processing route for the assembly of periodic arrays of sub-micrometer and nanoscale structures

Abstract

A substrate-based templated assembly route has been devised which offers large-area, high-throughput capabilities for the fabrication of periodic arrays of sub-micrometer and nanometer-scale structures. The approach overcomes a significant technological barrier to the widespread use of substrate-based templated assembly by eliminating the need for periodic templates having nanoscale features. Instead, it relies upon the use of a dynamic template with dimensions that evolve in time from easily fabricated micrometer dimensions to those on the nanoscale as the assembly process proceeds. The dynamic template consists of a pedestal of a sacrificial material, typically antimony, upon which an ultrathin layer of a second material is deposited. When heated, antimony sublimation results in a continuous reduction in template size where the motion of the sublimation fronts direct the diffusion of atoms of the second material to a predetermined location. The route has broad applicability, having already produced periodic arrays of gold, silver, copper, platinum, nickel, cobalt, germanium and Au-Ag alloys on substrates as diverse as silicon, sapphire, silicon-carbide, graphene and glass. Requiring only modest levels of instrumentation, the process provides an enabling route for any reasonably equipped researcher to fabricate periodic arrays that would otherwise require advanced fabrication facilities.

The process of solid-state dewetting of Au thin films studied by in situ scanning transmission electron microscopy

“…Approaches include pre-patterning the substrate [10][11][12][13][14][15] or the thin film [16][17][18][19] and the introduction of a sacrificial layer [20,21]. Applications of the produced particle arrays are envisaged to range from templates for the growth of nanostructures [22,11,23,24], magnetic storage arrays [25,26], optical sensors [27,28] and plasmonic systems [29,30], over photocatalytic reactors [31] to plasmon-enhanced back reflectors in solar cells [32,33].…”

Eutectic Combinations as a Pathway to the Formation of Substrate‐Based Au‐Ge Heterodimers and Hollowed Au Nanocrescents with Tunable Optical Properties

“…The assembly process begins with the formation of substrate‐immobilized Au nanostructures able to act as heterogeneous nucleation sites for Ge adatoms. The current work relies on both the formation of (i) structures as periodic arrays formed using a lithography‐free templated assembly technique referred to as dynamic templating and (ii) structures with a randomized size and placement formed through the agglomeration of an ultrathin Au film at elevated temperatures (i.e. solid state dewetting) .…”

“…Assembly of Heterogeneous Nucleation Sites : Au and Ag heterogeneous nucleation sites were formed on (0001)‐oriented sapphire substrates (MTI) or Si 3 N 4 support films (EMS) as both periodic arrays and as structures with randomized size and position. These assembly processes have been described in detail elsewhere . It should be noted that the Au and Ag assembly processes were each carried out in a dedicated quartz tube to prevent cross‐contamination.…”

Spectrally Tailored Light‐Matter Interaction in Lithography‐Free Functional Nanomaterials

“…Such limitations have to be overcome for applications that require a perfect organization and monodispersity both at the nanoscale and at the macroscopic scale, such as sensing. In this context, several approaches have shown appealing results to grow nearly perfect 2D assemblies of noble metal nanoparticles: combining microstencil shadowed deposition with dynamic templating based on sacrificial layers and combining soft lithography with dynamic templating or thermal dewetting …”

“…shown appealing results to grow nearly perfect 2D assemblies of noble metal nanoparticles: combining microstencil shadowed deposition with dynamic templating based on sacrificial layers and [9] combining soft lithography with dynamic templating [10] or thermal dewetting. [11,12]…”