Dynamic Wetting and Dewetting of a Low-Energy Surface by Pure Liquids

Schneemilch, M.; Hayes, Robert A.; Petrov, Jordan G.; Ralston, John

doi:10.1021/la980476k

Cited by 93 publications

(99 citation statements)

References 16 publications

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“…There is no exact expression relating interface width and the effective slip length, however, λ = δ/2R 0 is suggested as a good rule of thumb in Ding and Spelt [19], where λ is the dimensionless effective slip length for a diffuse interface model. It is claimed that the slip length can be as large as 50 nm [20], which is close to the chosen interface width in the present work, although the drop radius is only 1 µm. The slip length is found by Ding and Spelt to influence the onset of oscillations that occur when the droplet transitions from the inertial stage to the diffusive stage.…”

Section: Introductionsupporting

confidence: 76%

Modeling the early stages of reactive wetting

2010

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Recent experimental studies of molten metal droplets wetting high temperature reactive substrates have established that the majority of triple-line motion occurs when inertial effects are dominant. In light of these studies, this paper investigates wetting and spreading on reactive substrates when inertial effects are dominant using a thermodynamically derived, diffuse interface model of a binary, three-phase material. The liquid-vapor transition is modeled using a van der Waals diffuse interface approach, while the solid-fluid transition is modeled using a phase field approach. The results from the simulations demonstrate an O t − 1 /2 spreading rate during the inertial regime and oscillations in the triple-line position when the metal droplet transitions from inertial to diffusive spreading. It is found that the spreading extent is reduced by enhancing dissolution by manipulating the initial liquid composition. The results from the model exhibit good qualitative and quantitative agreement with a number of recent experimental studies of hightemperature droplet spreading, particularly experiments of copper droplets spreading on silicon substrates. Analysis of the numerical data from the model suggests that the extent and rate of spreading is regulated by the spreading coefficient calculated from a force balance based on a plausible definition of the instantaneous interface energies. A number of contemporary publications have discussed the likely dissipation mechanism in spreading droplets. Thus, we examine the dissipation mechanism using the entropy-production field and determine that dissipation primarily occurs in the locality of the triple-line region during the inertial stage, but extends along the solid-liquid interface region during the diffusive stage. * Electronic address: daniel.wheeler@nist.gov 1 arXiv:1006.4881v1 [cond-mat.mtrl-sci]

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Section: Introductionsupporting

confidence: 76%

Modeling the early stages of reactive wetting

2010

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“…Average jumping distance Ȝ ranges from 0.65 to 0.77 nm which is in agreement with assumption of the order of molecular dimension ( § nm). The frequency of molecular displacement K moves within the order of 10 6 s -1 which is physically correct and similar to previously published data [19,25]. The molecular-kinetic model was determined as an appropriate one for almost the whole range of TPC expansion and can be thus used for the description of the TPC line motion.…”

Section: Resultssupporting

confidence: 82%

Description of the three-phase contact line expansion

Váchová

Brabcová

Basařová

2014

EPJ Web of Conferences

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Abstract. Knowledge of bubble-particle interaction is important in many industrial processes such as in flotation. While the collision (first interaction sub-process) between bubbles and particles is influenced only by hydrodynamic forces, the bubble behaviour during the attachment (second sub-process) is influenced both by hydrodynamic and surface forces. This work is focused on the study of the three-phase contact (TPC) line expansion during bubble adhesion on hydrophobic surface and on its experimental and mathematical description. The experiments were carried out in pure water where mobile bubble surface is expected. The rising bubble was studied in dynamic arrangement, whereas the stationary bubble was analysed in static arrangement. The attachment process was recorded using a high-speed digital camera and evaluated using image analysis. The diameter of the expanding TPC line as well as the dynamic contact angle was determined. Two approaches -the hydrodynamic and the molecular-kinetic -were used for mathematical description of the TPC line expansion. According to our results, the hydrodynamic model is suitable for the description of the initial fast phase of the expansion. The molecular-kinetic model was assessed as appropriate for almost whole range of TPC expansion. Parameters of the model were evaluated and compared for both types of arrangement.

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“…The results from the hydrodynamic fitting imply a value of L s ≈ 0. Most hydrodynamic analysis of lowtemperature data will result in a slip length of microscopic but measurable dimensions (typically between 0.001 and 1 µm) [25,31,36]. The values of L s derived from our experiments are not consistent with the continuum description of spreading.…”

Section: Models For Spreadingmentioning

confidence: 69%

“…There is a wide range of molecular displacement frequencies reported for low-temperature liquids (from 10 3 to 10 10 s -1 ) [24,36,38]. The values calculated from the experiments reported in this paper are at the top of that range.…”

Section: Models For Spreadingmentioning

confidence: 69%

Spreading of Sn-Ag solders on FeNi alloys

et al. 2003

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The spreading of Sn-3Ag-xBi solders on Fe-42Ni has been studied using a drop transfer setup. Initial spreading velocities as fast as ~0.5 m/s have been recorded. The results are consistent with a liquid front moving on a metastable, flat, unreacted substrate and can be described by using a modified molecular-kinetic model for which the rate controlling step is the movement of one atom from the liquid to the surface of the solid substrate. Although the phase diagram predicts the formation of two Fe-Sn intermetallics at the solder/substrate interface in samples heated at temperatures lower than 513°C, after spreading at 250°C only a thin FeSn reaction layer could be observed. Two interfacial layers (FeSn and FeSn 2 ) were found after spreading at 450°C.

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Dynamic Wetting and Dewetting of a Low-Energy Surface by Pure Liquids

Cited by 93 publications

References 16 publications

Modeling the early stages of reactive wetting

Modeling the early stages of reactive wetting

Description of the three-phase contact line expansion

Spreading of Sn-Ag solders on FeNi alloys

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