2011
DOI: 10.1016/j.egypro.2011.06.182
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Economic Evaluation of Two-Step Metallization Processes for Silicon Solar Cells

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Cited by 30 publications
(21 citation statements)
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“…Simultaneously however, both manufacturing and production costs have to decrease. Rising silver prices affect the production costs because of the silver required for metallization: Solely the front side metallization accounts for about 20 % of standard cell production costs [1]. However, the front-side metallization is also vulnerable to many losses, including resistivity at the metal/semiconductor interface, line resistivity of fingers, and losses due to optical shading [2].…”
Section: Introductionmentioning
confidence: 99%
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“…Simultaneously however, both manufacturing and production costs have to decrease. Rising silver prices affect the production costs because of the silver required for metallization: Solely the front side metallization accounts for about 20 % of standard cell production costs [1]. However, the front-side metallization is also vulnerable to many losses, including resistivity at the metal/semiconductor interface, line resistivity of fingers, and losses due to optical shading [2].…”
Section: Introductionmentioning
confidence: 99%
“…Left: Comparing DSC curves of SiNx powder with bismuth-neo solution (solid green[1]), zinc-neo solution (dotted purple[2]), Ag-neo powder (dotted blue[3]), and our26 wt% metal content ink (solid red[4]). Right: EDX image of an etched pyramid by a low-concentration ink cured at 500 °C for 5 min.…”
mentioning
confidence: 99%
“…This technique has shown a 0.4% abs increase in cell efficiency as compared to screen printed traces. [6] We have shown with our CAB-DW print system, which has an improved nozzle design to the Aerosol Jet, traces with widths down to 5 µm. [2] In that work we compiled a model from literature which calculates the optimum trace width for a given set of material, and cell parameters.…”
Section: Introductionmentioning
confidence: 99%
“…Then, a conductive layer is plated to increase the finger thickness and conductivity. Silver could be chosen, but the final goal is to introduce copper, which is more cost-effective [10], [11]. In this case, three metal layers (Ni/Cu/Sn or Ni/Cu/Ag) are used as copper oxidation must be prevented by a capping layer.…”
Section: Introductionmentioning
confidence: 99%
“…Typically, the height of printed lines is in the range of 10-20 μm with a width of 60-100 μm [3]. Although the screen printing process is still considered as the main technology for the coming years [4], [5], more advanced solutions used in the laboratory have become available on an industrial scale [6]- [9] to improve efficiency at lower cost [10], [11].…”
Section: Introductionmentioning
confidence: 99%