Effect of 2,2′-dipyridyl on the plating rate, microstructure and performance of copper-coated tungsten composite powders prepared using electroless plating

Chen, Wenshu; Luo, Guoqiang; Li, Meijuan; Shen, Qiang; Wang, Chuanbin; Zhang, Lianmeng

doi:10.1016/j.apsusc.2014.01.107

Cited by 16 publications

(10 citation statements)

References 18 publications

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“…During the electroless plating process, the copper atoms firstly aggregate as clusters at the solid-liquid interface and then conditionally precipitate on the surface of tungsten particles. The clusters precipitated are dominated by the surface energy distribution, normally from high to low [16]. Thus, the Cu coating consists of copper cluster agglomeration particles with nanosize which can be clearly seen in enlarged insets in Fig.…”

Section: Microstructure Of Coated Powdersmentioning

confidence: 92%

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Preparation and properties of W–Cu–Zn alloy with low W–W contiguity

Zheng

Liu

et al. 2015

Rare Met.

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The W-Cu-Zn alloy with a-brass matrix and low W-W contiguity was prepared by method of electroless copper plating combined with spark plasma sintering (SPS) method. The effects of process and parameters on the microstructure and mechanical properties of the alloy were investigated. The W-Cu-Zn alloy with a relative density of 96 % and a W-W contiguity of about 10 % was prepared by original fine tungsten particles combined with wet mixing method and SPS solid-state sintering method at 800°C for 10 min. The microstructure analysis shows that Cu-Zn matrix consists of nano-sized a-brass grains, and the main composition is Cu 3 Zn electride. The nano-sized Cu was coated on the surface of tungsten particles by electroless copper plating method, and the fairly low consolidation temperature and short solid-state sintering time result in the nano-sized matrix phase. The dynamic compressive strength of the W-Cu-Zn alloy achieves to 1000 MPa, but the alloy shows poor ductility due to the formation of the hard and brittle Cu 3 Zn electrides. The fine-grain strengthening and the solution strengthening of the Cu-Zn matrix phase are responsible for the high Vickers microhardness of about 300 MPa for W-Cu-Zn alloy.

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Section: Microstructure Of Coated Powdersmentioning

confidence: 92%

“…Tungsten particles with average sizes of 5 and 44 lm (purity [99.9 %) were coated with Cu, respectively, by electroless plating [16]. Copper-coated tungsten powders were then annealed at the temperature of 400°C for 1.5 h in vacuum.…”

Section: Methodsmentioning

confidence: 99%

Preparation and properties of W–Cu–Zn alloy with low W–W contiguity

Zheng

Liu

et al. 2015

Rare Met.

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“…Electroless Cu plating of W powders is an efficient chemical method relied on feasible autocatalytic redox reaction in aqueous solution to achieve high purity W-Cu composite powders with improved wettability between W and Cu powder particles and composition homogeneity. 1,[61][62][63][64][65][66][67] In the electroless deposition of Cu on W powders should be considered the preparation approach of the surface of W particles, choice and amount of main salts, reducing and stabilization agents of the plating solution. Electrical and thermal conductivities of W-Cu composite powders are not decreased as in case of W-Cu composites containing sintering aids such as Ni, Fe, Co or other transition element.…”

Section: Electroless Copper Plating Of Tungsten Powdersmentioning

confidence: 99%

“…Chen et al, 64 used similar reactants in their study as in the study performed by Ibrahim et al, 1 but added various amounts of 2,2'-dipyridine (C 10 H 8 N 2 ) as stabilizing agent to prepare electroless Cu plating of W powders with particle size of 10 µm. Prior to Cu plating, the surface of W powder was cleaned with NaOH and HCl solutions for 20 min then washed several times with deionized water.…”

Section: Electroless Copper Plating Of Tungsten Powdersmentioning

confidence: 99%

“…57,59 Electroless Cu plating of W powders is another efficient method to synthesize fine W-Cu composite powders. 29,[61][62][63][64][65][66][67] Synthesis of W-Cu composite oxide powders in nano and micro scales by chemical means has the following advantages: obtaining of new advanced materials, extension to large-scale manufacturing and achievement of high yields. Chemical synthesis methods allow manipulation and mixing of materials at molecular level, which can result in advanced homogeneity degrees when the macroscopic properties of the materials are known along with the conditions in which they assemble.…”

Section: Introductionmentioning

confidence: 99%

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Synthesis and Processing Techniques of Tungsten Copper Composite Powders for Electrical Contact Materials A Review

Lungu

2019

Orient. J. Chem

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This review presents a general survey on synthesis and processing techniques of tungsten copper (W-Cu) composite powders for achieving electrical contact materials for power engineering applications. Several chemical and mechano-chemical synthesis methods for obtaining W-Cu composite powders in nano or micro scales from various W and Cu metal salt precursors combined with hydrogen reduction or nitridation-denitridation processes are reported along with powder metallurgy (PM) techniques employed in manufacturing W-Cu electrical contact materials. The main advantages and disadvantages of synthesis and processing techniques are summarized, too. The interdepencies among the properties of starting materials and final products in relation with synthesis and processing parameters are highlighted. The review reveals that the development of W-Cu advanced materials with improved properties and scale-up potential is of a great interest in practical applications related to materials science and engineering field.

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Electroless Copper Plating on Liquid Crystal Polymer Films Using Dimethylamine Borane as Reducing Agent

Zhang

Ding

2016

J Chinese Chemical Soc

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Dimethylamine borane (DMAB) was used in electroless copper plating on liquid crystal polymer (LCP) films. An orthogonal test was applied to optimize the plating condition. With Cu film resistivity as the evaluation index, the optimum plating condition is: 10 g/L of CuSO 4 ×5H 2 O, 14 g/L of EDTA-2Na, 6 g/L of DMAB, 9.5 of pH value and 50°C. As pH value increases, the Cu film resistivity decreases and the deposition rate increases. As temperature increases, the Cu film resistivity decreases first and then increases with a minimum at 50°C while the deposition rate increases first and then decreases with a maximum at 50°C. The decreased Cu film resistivity can be attributed to the occurrence of CuO. The adhesive strength of copper layer to LCP film is constant at pH values lower than 8.5 and decreases slightly with the increase in pH value. As temperature increases, the adhesive strength decreases slightly. The decreased adhesive strength with both pH and temperature may be a result of an increased corrosion attack from the bath to the surface of LCP films. Low Cu film resistivity and high deposition rate as well as high adhesive strength can be obtained using DMAB reducing agent.

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Effect of 2,2′-dipyridyl on the plating rate, microstructure and performance of copper-coated tungsten composite powders prepared using electroless plating

Cited by 16 publications

References 18 publications

Preparation and properties of W–Cu–Zn alloy with low W–W contiguity

Preparation and properties of W–Cu–Zn alloy with low W–W contiguity

Synthesis and Processing Techniques of Tungsten Copper Composite Powders for Electrical Contact Materials A Review

Electroless Copper Plating on Liquid Crystal Polymer Films Using Dimethylamine Borane as Reducing Agent

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