Effect of Abrasive Particle Size on Lapping of Sapphire Wafer by Fixed Abrasive Pad

Wang, Jian Bin; Li, Zhen; Zhu, Yixiao; Jiang, Ben Chi; Shi, Pei Cheng

doi:10.4028/www.scientific.net/kem.764.106

Cited by 1 publication

(1 citation statement)

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“…It is mainly divided into the rotation of the spindle, the rotation of the workpiece deviating from the spindle, and the vertical feed movement of the workpiece. The relative movements of the workpiece and the polishing plate 31 result in the removal of LT, and the feed movement of the pressing head maintains the processing load. In this way, the surface roughness of the workpiece is reduced and LT is removed uniformly.…”

Section: The Establishment Of Kinetic Modelingmentioning

confidence: 99%

Kinetic Modeling and Material Removal Mechanism Analysis of Fixed-Abrasive Polishing for Lithium Tantalite Wafer

Hang,

Ye,

Chen

et al. 2024

ECS J. Solid State Sci. Technol.

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As a typical multi-functional soft-brittle ceramics material, lithium tantalate (LT) exhibits excellent electro-optical and ferroelectric properties and has now been widely applied in many fields, such as electro-optical modulators, pyroelectric detectors, and surface acoustic wave substrates. Traditional free-abrasive polishing processing of lithium tantalite crystals is generally fraught with poor efficiency for its lower fracture toughness. This study proposed a method of polishing lithium tantalite wafer by means of fixed-abrasive plates. A cutting force model and the relative cutting speed model of the machining mechanism of fixed-abrasive plates were first established, and then the main influencing factors of cutting force and relative cutting speed were analyzed on the basis of the theoretical model. It was found that cutting force is influenced by eccentricity and load, while relative cutting speed is influenced by eccentricity and the fixed-abrasive plates’ rotation speed. Finally, single-factor tests were conducted on these influencing factors, and the comparative analysis between the experimental results and those in the theoretical model shows that they are highly correlated to each other. After 30 minutes of polishing under the optimized parameters w=60rpm, e=90mm, variable load, the surface roughness Sa of the workpiece is reduced to 1.234 nm, and the MRR reaches 14.821 μm/h.

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Section: The Establishment Of Kinetic Modelingmentioning

confidence: 99%