Effect of activated slip systems on dynamic recrystallization during rotary swaging of electro-conductive Al-Cu composites

Kunčická, Lenka; Kocich, Radim

doi:10.1016/j.matlet.2022.132436

Cited by 16 publications

(12 citation statements)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The substantial grain refinement observed for the structures of both the metallic components of the swaged laminates was particularly introduced by the intensive plastic deformation method of rotary swaging. This method gradually imparts small increments of shear strain, by which it supports repeated dynamic recrystallization [17]. The occurrence of dynamic recrystallization introduced by the high imposed shear strain was confirmed not only by the severely refined grains, but also by the grain boundary analyses, and the analyses of internal grains misorientations documented that the metallic components (especially Al) featured more or less relaxed microstructures.…”

Section: Discussionmentioning

confidence: 75%

“…Research in virtually every industrial field has led to the introduction of numerous innovative components, as well as a variety of modern materials, such as alloys prepared by methods of additive manufacturing (e.g., selective laser melting [1,2], direct energy deposition [3,4], plasma arc melting [5,6], etc. ), (pseudo)alloys fabricated via powder metallurgy [7,8], hybrid materials [9,10], functionally graded materials [11,12], high entropy alloys (HEAs) [13,14], or composites [15][16][17]. Composites can be of various types and can consist of several materials (e.g., metals [18], ceramics [19], polymers [20], or their variations, such as metallic glasses with polymers [21], polymers with nanoparticles [22], or ceramics with polymers [23]).…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Effect of Stacking Sequence on Mechanical Properties and Microstructural Features within Al/Cu Laminates

Kunčická,

Kocich

2023

Materials

View full text Add to dashboard Cite

The study presents a method to prepare Al/Cu laminated conductors featuring two different stacking sequences using rotary swaging, a method of intensive plastic deformation. The primary focus of the work was to perform detailed characterization of the effects of room temperature swaging on the development of microstructures, including the Al/Cu interfaces, and internal misorientations pointed to the presence of residual stress within the laminates. The results revealed that both the Al and Cu components of the final laminates with 5 mm in diameter featured fine, more or less equiaxed, grains with no dominating preferential texture orientations (the maximum observed texture intensity was 2.3 × random for the Cu components of both the laminates). This fact points to the development of dynamic restoration processes during swaging. The analyses of misorientations within the grains showed that residual stress was locally present primarily in the Cu components. The Al components did not feature a substantial presence of misorientations, which confirms the dynamic recrystallization. Tensile testing revealed that the laminates with both the designed stacking sequences exhibited comparable UTS (ultimate tensile strength) of almost 280 MPa. However, notable differences were observed with regard to the plasticity (~3.5% compared to less than 1%). The laminate consisting of Al sheath and Cu wires exhibited very low plasticity as a result of significant work hardening of Al; this hypothesis was also confirmed with microhardness measurements. Observations of the interfaces confirmed satisfactory bonding of both the metallic components.

show abstract

Section: Discussionmentioning

confidence: 75%

Section: Introductionmentioning

confidence: 99%

Effect of Stacking Sequence on Mechanical Properties and Microstructural Features within Al/Cu Laminates

Kunčická,

Kocich

2023

Materials

View full text Add to dashboard Cite

show abstract

“…Copper-aluminium composite has excellent conductivity and can achieve the effect of saving copper, as has been shown in the application of power transmission and transformation materials. [1][2][3] Although composites can inherit most of the advantages of their constituent materials in most cases, they are quite opposite in terms of corrosion resistance. The application and promotion of this kind of material are limited due to the galvanic corrosion caused by the potential difference at the copper-aluminium interface.…”

Section: Introductionmentioning

confidence: 99%

Comparative study on mechanism of DC and AC current on corrosion of copper–aluminium composites

Cheng,

Zhang,

et al. 2024

Corrosion Engineering, Science and Technology: The Internationa

View full text Add to dashboard Cite

In this study, corrosion behaviours accelerated by neutral salt spray were thoroughly investigated on copper–aluminium composites with 3 wt% concentration NaCl for 72 h under DC and AC current respectively. The similarities and differences of the corrosion mechanism of the copper–aluminium composite under the two kinds of current were analysed by weight loss analysis, scanning electron microscopy, energy-dispersive X-ray spectroscopy and electrochemical detection methods. It can be concluded that there are two opposing influences of the current on the corrosive effects, including acceleration by the impressed current and inhibition by the heating effect. Of these, the inhibition effect on corrosion is more obvious, as the thermal effect of DC current is greater under the same current value. It is worth noting that the directional migration of ions caused by DC current will affect the degree of corrosion and the composition of the corrosion products on the surfaces of both sides of the samples, which is a unique characteristic not seen with AC current.

show abstract

“…[3][4][5][6][7][8]. iii) to use optimized thermomechanical (deformation) treatment (e. g. via rotary swaging, or methods of severe plastic deformation) [9][10][11][12]. The mentioned methods of plastic deformation can favorably strengthen the processed materials as they impart the generation of dislocations, which subsequently form dislocation cells and walls and consequently subgrains (typically defined with low angle grain boundaries), which finally develop into individual grains (typically defined with high angle grain boundaries) [13].…”

Section: Introductionmentioning

confidence: 99%

Correlation of structure development and electric characteristics within high pressure torsion processed copper

Kocich,

Kopeček,

Marek

2024

Materialwissenschaft Werkst

View full text Add to dashboard Cite

Copper of a high purity features excellent electric conductivity, but generally very low mechanical properties. Nevertheless, optimized deformation/thermomechanical treatment can introduce favorable combinations of both. The presented study characterizes the correlation of microstructure development and electric properties within copper processed by the severe plastic deformation method of high pressure torsion, the primary advantage of which is that it enables to achieve grains with the sizes in the ultra‐fine, or even nano scales. The study investigates structure development during progressive deformation. In other words, samples processed by single and double high pressure torsion revolutions were evaluated from the viewpoints of grain sizes and grain boundaries, and the results were correlated with the experimentally measured electric conductivity. The single high pressure torsion revolution contributed to grain size decrease, while the structure after double revolution exhibited very fine grains, especially at the sample periphery featuring the highest imposed strain. Both the samples also exhibited increases in microhardness (especially after double revolution), and electric conductivity higher than 100 % IACS. The results confirmed that copper conductors featuring enhanced mechanical properties and favorable electric conductivity can be manufactured by severe plastic deformation.

show abstract

Effect of activated slip systems on dynamic recrystallization during rotary swaging of electro-conductive Al-Cu composites

Cited by 16 publications

References 13 publications

Effect of Stacking Sequence on Mechanical Properties and Microstructural Features within Al/Cu Laminates

Effect of Stacking Sequence on Mechanical Properties and Microstructural Features within Al/Cu Laminates

Comparative study on mechanism of DC and AC current on corrosion of copper–aluminium composites

Correlation of structure development and electric characteristics within high pressure torsion processed copper

Contact Info

Product

Resources

About