Effect of adding 1wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

Rizvi, M.J.; Chan, Yin-Ching; Bailey, Christopher; Lu, Hua; Islam, M. N.

doi:10.1016/j.jallcom.2005.06.050

Cited by 85 publications

(54 citation statements)

References 17 publications

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“…In general, the growth rate of an intermediate phase during the interdiffusion of metals with volume diffusion predominated follows the parabolic rate law: [16][17][18][19][20][21] x À x 0 ¼ kt 1=2…”

Section: Imc Growth Kinetics During Aging Treatmentmentioning

confidence: 99%

elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-Bump metallization during aging

Jang

Duh

2006

J. Electron. Mater.

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In flip chip technology, Al/Ni(V)/Cu under-bump metallization (UBM) is currently applicable for Pb-free solder, and Sn-Ag-Cu solder is a promising candidate to replace the conventional Sn-Pb solder. In this study, Sn-3.0Ag-(0.5 or 1.5)Cu solder bumps with Al/Ni(V)/Cu UBM after assembly and aging at 150°C were employed to investigate the elemental redistribution and reaction mechanism between solders and UBMs. During assembly, the Cu layer in the Sn-3.0Ag-0.5Cu joint was completely dissolved into solders, while Ni(V) layer was dissolved and reacted with solders to form (Cu 1Ày ,Ni y ) 6 Sn 5 intermetallic compound (IMC). The (Cu 1Ày ,Ni y ) 6 Sn 5 IMC gradually grew with the rate constant of 4.63 3 10 À8 cm/sec 0.5 before 500 h aging had passed. After 500 h aging, the (Cu 1Ày ,Ni y ) 6 Sn 5 IMC dissolved with aging time. In contrast, for the Sn-3.0Ag-1.5Cu joint, only fractions of Cu layer were dissolved during assembly, and the remaining Cu layer reacted with solders to form Cu 6 Sn 5 IMC. It was revealed that Ni in the Ni(V) layer was incorporated into the Cu 6 Sn 5 IMC through slow solid-state diffusion, with most of the Ni(V) layer preserved. During the period of 2,000 h aging, the growth rate constant of (Cu 1Ày ,Ni y ) 6 Sn 5 IMC was down to 1.74 3 10 À8 cm/sec 0.5 in the Sn-3.0Ag-1.5Cu joints. On the basis of metallurgical interaction, IMC morphology evolution, growth behavior of IMC, and Sn-Ag-Cu ternary isotherm, the interfacial reaction mechanism between Sn-3.0Ag-(0.5 or 1.5)Cu solder bump and Al/Ni(V)/Cu UBM was discussed and proposed.

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Section: Imc Growth Kinetics During Aging Treatmentmentioning

confidence: 99%

elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-Bump metallization during aging

Jang

Duh

2006

J. Electron. Mater.

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“…[1][2][3][4][5][6][7][8]. To avoid the excessive loss of solid metals in contact with the alloys during soldering, data on metal dissolution rates in molten solders are needed.…”

Section: Introductionmentioning

confidence: 99%

Dissolution Kinetics of Nickel in Lead-free Sn-Bi-In-Zn-Sb Soldering Alloys

Barmak

Berry

Khoruzha³

et al. 2007

MRS Proc.

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The dissolution process of nickel in liquid Pb-free 87.5% Sn-7.5% Bi-3% In-1% Zn-1% Sb and 80% Sn-15% Bi-3% In-1% Zn-1% Sb soldering alloys has been investigated by the rotating disc technique at 250-450°C. The temperature dependence of the nickel solubility in the solders obeys a relation of the Arrhenius type c s = 4.94 × 10 2 exp (-39500/RT) % for the former alloy and c s = 4.19 × 10 2 exp (-40200/RT) % for the latter, where R is in J mol -1 K -1 (8.314 J mol -1 K -1 ) and T in K. The solubility values of nickel in the alloys differ considerably, while the dissolution rate constants are rather close. The data presented can be used to evaluate (i) the thickness of the dissolved portion of the solid nickel material during soldering, (ii) the extent of saturation of a solder with nickel and (iii) the effect of dissolution on the growth rate of intermetallic layers at the Ni-solder interface.

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“…A lot of researches have been done to solve these problems, for example, adding a certain content of Bi in SAC0307 can reduce the melting point of solder and improve the wettability 7) . The addition of Bi or Be in the SAC solder could limit the growth of the intermetallic compound (IMC) and improve the mechanical properties of solder 8,9) . A kind of low-temperature stirring soldering of low-silver SAC solder was studied by Gan, which found that the IMC growth of joint was signi cantly inhibited by adding Ni nanoparticles 10,11) .…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Shear Strength of Low-Silver SAC/Cu Solder Joints during Aging

Luo

Gan

et al. 2016

Mater. Trans.

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A new type of low-silver hypoeutectic SAC lead-free solder was prepared, and then hot dip soldering was used to form the joints of copper. The microstructure evolution of IMCs and the variation of shear strength of solder joints were investigated. The results have shown that the thickness of the IMC layer increased over time and the scallop-type IMC became a hump like shape during the aging process. The growth rates of the IMC layer were 0.61 × 10 −14 cm 2 /s, 2.06 × 10 −14 cm 2 /s, 4.83 × 10 −14 cm 2 /s at 348 K, 373 K and 423 K respectively. The shear strength of solder joint fell sharply at rst and then became slow, nally dropped from 40.94 MPa to 29.73 MPa after aging at 423 K for 12 days. Moreover, the fracture mode changed from ductile fracture to local brittle fracture with the increasing of aging time.

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Effect of adding 1wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

Cited by 85 publications

References 17 publications

elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-Bump metallization during aging

elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-Bump metallization during aging

Dissolution Kinetics of Nickel in Lead-free Sn-Bi-In-Zn-Sb Soldering Alloys

Microstructure and Shear Strength of Low-Silver SAC/Cu Solder Joints during Aging

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