2006
DOI: 10.1016/j.ijadhadh.2005.10.002
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Effect of adhesive on the performance of piezoelectric elements used to monitor structural health

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Cited by 92 publications
(71 citation statements)
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“…Three applications were presented: (1) monitoring of the cure progress of the bonded repair adhesive, (2) identification of the initial artificial debonding between the composite patch and the metal structure, and (3) monitoring of the damage repaired by a bonded patch, which is under fatigue cycles. Qing et al (2006b) investigated experimentally the effect of adhesive thickness and its elastic modulus on the performance of adhesively bonded piezoelectric elements, which are used for structural health monitoring. The piezoelectric elements were adhesively bonded to aluminum plates.…”
mentioning
confidence: 99%
“…Three applications were presented: (1) monitoring of the cure progress of the bonded repair adhesive, (2) identification of the initial artificial debonding between the composite patch and the metal structure, and (3) monitoring of the damage repaired by a bonded patch, which is under fatigue cycles. Qing et al (2006b) investigated experimentally the effect of adhesive thickness and its elastic modulus on the performance of adhesively bonded piezoelectric elements, which are used for structural health monitoring. The piezoelectric elements were adhesively bonded to aluminum plates.…”
mentioning
confidence: 99%
“…Irrespective of whether EWP or EMI is used, measurements are first performed on the pristine structure to establish a baseline against which subsequent measurement data are compared ( (Qing et al, 2006a), p624). With EWP for example when damage develops it interacts with the transmitted (incident) waves (Figure 1.3), this alters the wave received at the sensor, for example changing its shape, phase, amplitude (Figure 1.4), time of arrival or impedance spectrum ( (Overly et al, 2009), p1415).…”
Section: Shm Overviewmentioning
confidence: 99%
“…The interface provides the mechanical coupling to transfer the force and strain between the piezoelectric element and the structure ( (Qing et al, 2006a), p622).…”
Section: 142mentioning
confidence: 99%
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