Effect of Ag addition to Zn–12Al alloy on kinetics of growth of intermediate phases on Cu substrate

Gancarz, Tomasz; Pstruś, J.; Fima, Przemysław; Mosińska, Sylwia

doi:10.1016/j.jallcom.2013.08.055

Cited by 36 publications

(49 citation statements)

References 15 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The Zn-Al-Cu solder exhibited an electrical resistivity of 5.5 to 7.0 lX cm at room temperature, which was lower than that of the Sn-37Pb solder (14.25 lX cm [18] ). The obtained electrical resistivity and CTE for ZnAl with Cu are similar to those for ZnAl with Ag, [6] which were 24.03, 25.27, and 29.75 cm 3 /mol for 0.5, 1.0, and 1.5 pct Ag, respectively.…”

Section: Resultssupporting

confidence: 64%

“…The interposition of Cu in ZnAl alloys is intended to create IMP precipitates that block the formation of IMP layers on the substrate in the wetting test, as observed with the addition of Ag to ZnAl. [6] The values of ultimate tensile strength (UTS) are summarized in Table II. Measurements for R m (tensile strength) were obtained using tensile testing.…”

Section: Resultsmentioning

confidence: 99%

“…The thermal expansion coefficient was measured using a TMA Netzsch Pegasus for a temperature range from 223 K to 473 K (À50°C to 200°C), at a heating rate of 2 K/ min (°C/min), with a gas flow of 20 mL/min, and a force of 0.1 mN. [6] The soldered joint was formed by wetting the joined materials with solder during the soldering process. Therefore, the study of the properties of the solders is based on an assessment of their ability to wet the solder materials under certain conditions.…”

Section: Methodsmentioning

confidence: 99%

“…[1][2][3][4][5] However, the automotive and cooling industries have used solders with higher melting points. [6] Therefore, an important task is to develop new solders with appropriate wetting properties, melting points, mechanical strength, etc.…”

Section: Introductionmentioning

confidence: 99%

“…In response to market demand from the aerospace, automotive, and electronics industries, solder alloys for use at temperatures up to 623 K (350°C) have been developed, on the basis of eutectic ZnAl alloys with added Ag, [6] In, [7] and Cu. [8,9] The major contribution of the Vianco team, [10] which worked on alloys in the temperature range above 573 K (300°C), is noteworthy.…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

Effect of Cu Addition to Zn-12Al Alloy on Thermal Properties and Wettability on Cu and Al Substrates

Gancarz

Pstruś

Mosińska

et al. 2015

Metall Mater Trans A

Self Cite

View full text Add to dashboard Cite

TOMASZ GANCARZ, JANUSZ PSTRUS´, SYLWIA MOSIŃ SKA, and SYLWIA PAWLAK The thermal properties, electrical resistivity, thermal linear expansion and tensile strength of a new high-temperature lead-free solder based on a eutectic Zn-Al alloy with 0.5, 1.0, or 1.5 at. pct Cu added were studied. Wettability studies on Cu substrate were performed with flux at 773 K (500°C) for 60, 180, 240, 900, 1800, and 3600 seconds, and for 480 seconds at 733 K, 753 K, 773 K, 793 K, and 823 K (460°C, 480°C, 500°C, 520°C, and 550°C, respectively). The experiment was designed to demonstrate the effect of the addition of Cu on the kinetics of the formation and growth of the CuZn, Cu 5 Zn 8 , CuZn 4 , and Al 4 Cu 9 phases, which were identified by X-ray diffraction analysis. Wetting tests were also performed on the Al substrate, for 15 and 30 seconds at 773 K and 793 K (500°C and 520°C, respectively). Very low contact angles on Al pads were obtained. The electrical resistivity of Zn-Al-Cu alloys was slightly higher than that of the ZnAl eutectic alloy. The present results are discussed with respect to the available literature on Zn-Al and Zn-Al-Cu alloys.

show abstract

Section: Resultssupporting

confidence: 64%

Section: Resultsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%