In this study, the drop-melting elements B and Hf were added to the alloy material for TLP diffusion welding, and the solidification behavior of IC10 alloy joint was analyzed, and the growth mechanism of γ, γ' and related compounds in TLP connection was explored. The results shows that element B was distributed in the grain boundary of the ISZ region, which increases the binding force of the grain boundary and increases the strength of the grain boundary. As a melting element, Hf element affects the liquid phase line temperature of the middle layer and makes the co-crystal liquid phase have good fluidity. The content of Hf elements has a great influence on the widening stage of the liquid phase area, which increases the dissolution amount of the base material, increases the weld width, and increases the liquid phase metal of the weld, which increases the difficulty of isothermal solidification of the weld and increases the time. When the isothermal solidification is completed, the TLP joint tissue only achieves the local tissue composition homogeneity, and continues to extend the thermal insulation time, which is conducive to the further diffusion of the alloy elements.