“…Additionally, its thickness cannot be easily scaled down because when it approaches a few nanometers, ferroelectricity is lost. − As a solution to these challenges, ferroelectric materials based on nanoscale HfO x have been proposed. Because of its compatibility with CMOS, scalability, and advantageous bandgap, HfO x is widely used. − After the ferroelectric characteristics of doped HfO x films were initially revealed in 2011, investigations have recently been conducted to accelerate the development of the orthorhombic phase (o-phase) (space group: Pca2 1 ) (o-phase), employing dopants such as Zr, Al, Si, Y, and La. − In particular, the Al dopant provides mechanical stress in HfO x to stabilize the o-phase because Al has a smaller atomic radius than Hf. , Various structures of FTJs have been studied, including metal-ferroelectric-metal (MFM), metal-ferroelectric-insulator–metal (MFIM), metal-ferroelectric-silicon (MFS), and metal-ferroelectric-insulator-silicon (MFIS). − Notably, using silicon as a bottom electrode in the MFS configuration offers advantages such as self-rectification and a larger TER compared with MFM FTJs, which are attributed to the depletion region of the semiconductor. ,, …”