Effect of Al2O3/H2O nanofluid on MWNT circular fin structures in a minichannel

Tullius, Jami F.; Bayazıtoğlu, Yıldız

doi:10.1016/j.ijheatmasstransfer.2013.01.035

Cited by 29 publications

(4 citation statements)

References 42 publications

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“…The average base temperature (volume flow rate equal to 400 mL/min) is also much lower than literature data under variable heat flux, as shown in Figure 10. The performance of the heat sink in the cooling system is compared with [28] and [29] on HTC and temperature response with different heat source power. The calculation of Reynolds numbers is based on the properties of distilled water under 40˝C.…”

Section: Heat Sink Performancementioning

confidence: 99%

Experimental Study of Single Phase Flow in a Closed-Loop Cooling System with Integrated Mini-Channel Heat Sink

Zhao

Sun

et al. 2016

Entropy

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Abstract:The flow and heat transfer characteristics of a closed-loop cooling system with a mini-channel heat sink for thermal management of electronics is studied experimentally. The heat sink is designed with corrugated fins to improve its heat dissipation capability. The experiments are performed using variable coolant volumetric flow rates and input heating powers. The experimental results show a high and reliable thermal performance using the heat sink with corrugated fins. The heat transfer capability is improved up to 30 W/cm 2 when the base temperature is kept at a stable and acceptable level. Besides the heat transfer capability enhancement, the capability of the system to transfer heat for a long distance is also studied and a fast thermal response time to reach steady state is observed once the input heating power or the volume flow rate are varied. Under different input heat source powers and volumetric flow rates, our results suggest potential applications of the designed mini-channel heat sink in cooling microelectronics.

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Section: Heat Sink Performancementioning

confidence: 99%

Experimental Study of Single Phase Flow in a Closed-Loop Cooling System with Integrated Mini-Channel Heat Sink

Zhao

Sun

et al. 2016

Entropy

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“…Hence, to increase heat dissipating performance, it is suggested to select high thermal conductivity and larger size particles. Tullius et al 33 conducted experiments to find the heat transfer potential of silicon mini channel with alumina‐based nanofluid as the working fluid. They detected that due to the nanofluid, improved heat transfer from the base of the silicon is noticed.…”

Section: Introductionmentioning

confidence: 99%

Composite pin‐fin heat sink for effective hotspot reduction

Khan,

Ali,

Rehman

et al. 2024

Heat Trans

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This current work aims to decrease temperature nonuniformity in a microprocessor. The proposed composite pin‐fin heat sink design is analyzed computationally, and its functioning is compared with the conventional heat sink design. According to the heat rate, the composite heat sink is divided into two sections: the hotspot and the background section. Aluminum, copper, and graphene are chosen for the background and hotspot sections. Both noncomposite and composite heat sinks are designed with similar geometrical dimensions. DI water is used as the working fluid. They are studied for heterogeneous hotspot heat flux varying from 200 to 600 kW/m2 by keeping constant background heat flux as 100 kW/m2 with the inlet mass flow rate of 0.05 kg/s. Further simulations are performed for various Reynolds numbers (Re = 150, 225, 300) with a constant background and hotspot heat flux of 100 and 600 kW/m2, respectively, for different inlet temperatures of 15°C, 20°C, and 25°C. The simulations are also carried out for other working fluids, such as TiO2 and Fe2O3 based nanofluids with the constant volume concentration of 0.65% and 3%, respectively in the DI water, at the constant background and hotspot heat flux of 100 and 600 kW/m2, respectively. The results are shown for all the above studies planned. The results suggest that composite heat sinks with graphene as a composite material and Fe2O3 based nanofluid yields higher heat dissipation.

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“…At constant temperature boundary condition, heat flux enhancement of 2.3 and 1.6 times, compared to a device without MWCNTs was reported for MWCNT bundles and fully covered MWCNTs respectively. Further investigation were made by Tullius et al [35] to investigate the combined influence of a Al 2 O 3 /H 2 O nanofluid and MWCNTs on the heat transfer performance in the same setup. Little to no enhancement was obtained by using the combined nano-fluid in both fully covered and bundles of MWCNTs.…”

Section: Introductionmentioning

confidence: 99%