Effect of Al2O3 Nanoparticle Addition on the Microstructure, Mechanical, Thermal, and Electrical Properties of Melt-Spun SAC355 Lead-Free Solder for Electronic Packaging

Al-sorory, Hamed; Gumaan, Mohammed S.; Shalaby, Rizk Mostafa

doi:10.1007/s11665-022-07752-x

Cited by 3 publications

(3 citation statements)

References 45 publications

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“…TiO2 nanoparticles adsorption effect inhibits the growth of the IMC layer [8,13,24]. This result was in accordance with other findings where the IMC layer thickness decreased by approximately by 50% when reinforcing 0.50 wt% of TiO2 nanoparticles to SAC305 lead-free solder [13,15]. The adsorption effect of TiO2 and Al2O3 nanoparticles not only restrict the growth of the IMC layer but also serves as a diffusion barrier at the interface between molten solder and Cu substrate.…”

Section: Imc Growth Formationsupporting

confidence: 91%

“…Meanwhile, the liquidus (TL) temperature of SAC305 nanocomposite solder are increasing slightly from 231 to 233.5 °C as shown in Figure 1(b) and (c). Similar findings were also found that the melting point of SAC lead-free solder increase slightly when reinforced with TiO2 and Al2O3 nanoparticles [15,17]. Yet, the slight increment in the melting temperature is not a major concern as it still falls under the typical reflow temperature range for Pb-free solder which is 240-250°C.…”

Section: Thermal Propertiessupporting

confidence: 80%

“…Al2O3 nanoparticles was found can restrict the growth of IMC layer, reduce the grain size and improve the reliability of solder joints [5,14,15]. Besides, TiO2 nanoparticles could also inhibit the growth of IMC layer, have better wettability, strengthening the solder joints and increase the hardness of the solder [16][17][18].…”

Section: Introductionmentioning

confidence: 92%

See 2 more Smart Citations

Influence of TiO2 and Al2O3 Nanoparticles Addition on Thermal, Wettability and IMC Growth of Sn-3.0Ag-0.5Cu Lead-Free Solder at Different Reflow Temperature

Nur Haslinda Mohamed Muzni,

Ervina Efzan Mhd Noor,

Mohd Mustafa Al-Bakri Abdullah

2023

ARFMTS

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This study investigated the influence of adding 0.50 wt% and 1.0 wt% titanium dioxide (TiO2) and aluminium oxide (Al2O3) nanoparticles on the properties of Sn3.0Ag0.5Cu (SAC305) lead-free solder alloy. In terms of thermal properties, SAC305 lead-free solder with or without addition of TiO2 and Al2O3 nanoparticles, the melting temperature is very similar and comparable. The wetting performance of the SAC305 nanocomposite solder was determined by the contact angle. The best contact angle recorded is 31.65° at reflow temperature of 250°C for 0.50 wt% addition of TiO2 and Al2O3 nanoparticles. The thickness of the IMC layer was observed using an Optical Microscope and measured. Results show that the thickness of the IMC layer decreased when TiO2 and Al2O3 nanoparticles were reinforced into the SAC305 solder system, which shows significant decrease when 0.50wt% of TiO2 and Al2O3 nanoparticles were added. However, beyond 0.50 wt% the thickness of IMC layer increases along with increasing reflow temperature. The results reveal that the adsorption effect of TiO2 and Al2O3 nanoparticles will restrict the growth of the IMC layer under controlled concentration of the nanoparticles and reflow temperature. The optimal parameters to enhance the performance of SAC305 solder by reinforcing TiO2 and Al2O3 nanoparticles are reflowed at 250°C at 0.50 wt% concentration of TiO2 and Al2O3 nanoparticles.

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