Abstract:The effect of Al and Si addition on IMC formation at the solder and Cu substrate interface was investigated. The compositions of the solder alloy used are Sn-0.3 wt.% Ag-0.5 wt.% Cu (SAC0305), SAC0305-1 wt.% Al (SAC0305-1Al), SAC0305-2 wt.% Al (SAC0305-2Al) and SAC0305-2 wt.% Al-2 wt.% Si (SAC0305-2Al-2Si). Solder alloys were prepared by casting process. Melting temperature of each solder alloys was determined using DSC. Reflow process of the solder alloys were carried out at 260 oC on Cu substrate. Morphology… Show more
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