2018
DOI: 10.1021/acs.nanolett.7b04933
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Effect of an Auxiliary Plate on Passive Heat Dissipation of Carbon Nanotube-Based Materials

Abstract: Carbon nanotubes (CNTs) and other related CNT-based materials with a high thermal conductivity can be used as promising heat dissipation materials. Meanwhile, the miniaturization and high functionality of portable electronics, such as laptops and mobile phones, are achieved at the cost of overheating the high power-density components. The heat removal for hot spots occurring in a relatively narrow space requires simple and effective cooling methods. Here, an auxiliary passive cooling approach by the aid of a f… Show more

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Cited by 41 publications
(24 citation statements)
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References 41 publications
(67 reference statements)
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“…18,42 The surface emissivity values of hard CNT sponges and Al cooling fins are, respectively, determined as 0.88 and 0.03, using a similar method in the previous works. 21,38 According to equations S1−S5, hard CNT sponges have a much higher radiative cooling power (∼0.33 W) than that of Al cooling fins (∼0.008 W) when the system reaches thermal equilibrium. Detailed calculations can be found in Supporting Information.…”
Section: Resultsmentioning
confidence: 99%
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“…18,42 The surface emissivity values of hard CNT sponges and Al cooling fins are, respectively, determined as 0.88 and 0.03, using a similar method in the previous works. 21,38 According to equations S1−S5, hard CNT sponges have a much higher radiative cooling power (∼0.33 W) than that of Al cooling fins (∼0.008 W) when the system reaches thermal equilibrium. Detailed calculations can be found in Supporting Information.…”
Section: Resultsmentioning
confidence: 99%
“…The equilibrium chip temperatures with bare Cu, Al cooling fins, and hard CNT sponge are 109.3, 90.1, 88.1 °C, respectively. To quantitatively compare the cooling effect, the cooling efficiency is defined as η = Δ T /Δ T a × 100%, where Δ T is the difference between equilibrium chip temperature with samples and with bare Cu, and Δ T a is the chip temperature rise from the room temperature with only bare Cu. , The cooling efficiency of hard CNT sponge is 25.1%, which is higher than that of Al cooling fins (η = 22.8%), the disordered SWCNT composites (η = 5.4%), the multilayer SACNT films (η = 12.5%), and CaCl 2 /CNT films (η = 13.8%), as summarized in Figure b. The temperature difference between the chip with hard CNT sponges and with bare Cu (Δ T Cu – sponge ), between the chip with hard CNT sponges and with Al cooling fins (Δ T fins – sponge ) are depicted in Figure c.…”
Section: Results and Discussionmentioning
confidence: 99%
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“…During the whole process, the chip temperature of aerohydrogel was lower than that of the hydrogel and the Cu film, indicating a better heat dissipation ability of the aerohydrogel. To quantitatively probe the cooling effect, the cooling efficiency is adopted , where Δ T is the balanced temperature difference between bare Cu film and the tested samples and Δ T a is the difference between the initial and equilibrium temperature with the bare Cu film. The cooling efficiency of the aerohydrogel is 46.2%, which is 20.6% higher than that of the hydrogel (Figure c, inset).…”
Section: Resultsmentioning
confidence: 99%