Effect of annealing and microstructure on the creep behaviour of an Sn–10 wt % Sb alloy

Abstract

This paper concerns the effect of the two-phase microstructure (solid solution plus SnSb intermetallic) on the creep behaviour of an Sn-10 wt % Sb alloy. The alloy was specially cast and drawn into wires of 0.55 mm diameter. Samples were heat treated at temperatures of 348, 373, 398, 423 and 448 K to produce a range of volume fractions of the intermetallic b-phase SnSb. Constant-load creep tests were carried out at room temperature for each of the wire samples. The results obtained show that there is a relationship between the heat-treatment temperature T a and the microstructure and that this, in turn, affects the creep properties of the alloy. Quantitative scanning electron microscopy (SEM) analysis has been used to determine the relationship between the microstructure and the mechanical behaviour of the alloy independently of any microstructural changes which might occur during creep at more elevated temperatures. It is shown that the steady state creep rate can be described in terms of the mass fraction X Sb of antimony dissolved in the matrix phase, the mean grain size d (mm) and the applied stress | (MPa) by the equation 8.19 , where the strain rate is given in reciprocal seconds. Comparisons are made with other observations on the creep resistance of solder alternatives.

Morphology changes in solder joints––experimental evidence and physical understanding

“…From composite mechanics it is well known that ''inclusions'' affect the structural properties of a material sometimes for the better and sometimes for the worse. Note that particle strengthening by intermetallic compound precipitation is a relatively new development in solders and has the potential to balance the difficulties associated with coarsening [10].…”

Effect of rapid solidification on microstructure, creep resistance and thermal properties of Sn-10 wt.% Sb- 3 wt.% X ( X= In, Ag, Bi and Zn) lead-free solder alloys

“…Sn-Sb alloys are considered of great potential [14]. Most works, which have been carried out in this field were mainly focused on the mechanical properties of the bulk solders [15,16], such as the tensile property [17] and creep property [18,19]. The mechanical and electrical properties of solders are important because solder joints connect mechanically and electrically integrated circuit chips with the substrate.…”

Toward a better understanding of morphology changes in solders using phase field theories: Quantitative modeling and experimental verification

“…However, the impact must not necessarily have negative consequences. Particle strengthening by intermetallic compound precipitation is a relatively new development in solders and has the potential to balance the difficulties associated with coarsening [7]. In any case the speed and the impact of these processes on reliability will depend on the type of solders and additives and, in general, will always be present.…”