Effect of annealing on the microstructure and bonding interface properties of Ag–2Pd alloy wire

Tseng, Yi Wei; Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Mei Yu; Hsueh, Hao Wen

doi:10.1016/j.microrel.2015.05.012

Cited by 25 publications

(12 citation statements)

References 12 publications

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“…The pull test of the first bond was performed with a test length of 50 mm, yielding a strain rate of 5 × 10 −3 s −1 . Moreover, to better understand the differences between the Al-0.5Si and ZAS wires, current tests of the first bond (FAB) were compared [12][13][14][15][16], and a bias tensile test of the wires with different currents was performed. The schematic diagram in Figure 2 shows that, for the current test, the effective wire length was 30 mm, and the applied DC voltage increased at 0.05 V/sec from 0 V until the wire fused.…”

Section: Methodsmentioning

confidence: 99%

Aluminium Wires Have the Free Air Balls (FABs): Electronic Flame-Off, Fracture Strength, Electrical Properties, and Bonding Characteristics of Nano Zn Film Al–Si Bonding Wires

Hung

Lui

Chu

et al. 2017

Metals

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Aluminum wire is a common material for wire bonding due to its resistance to oxidation and low price. It does not melt when becoming a free air ball (FAB) during the electronic flame-off (EFO) process with wettability and is applied by wedge bonding. This study used 20 µm Zn-coated Al-0.5 wt % Si (ZAS) wires to improve the FAB shape after the EFO process, while maintaining the stability of the mechanical properties, including the interface bonding strength and hardness. In order to test circuit stability after ball bonding, the current-tensile test was performed. During the experiment, it was found that 80 nm ZAS with wire bonding had lower resistance and its fusing current was higher. For the bias tensile test, the thicker Zn film diffused into the Al-Si matrix easily, after which the strength was reduced. The ball-bond interfaces had no change in their condition before and after the bias. Accordingly, the ZAS wire could be a promising candidate for ball bonding in the future.

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Section: Methodsmentioning

confidence: 99%

Aluminium Wires Have the Free Air Balls (FABs): Electronic Flame-Off, Fracture Strength, Electrical Properties, and Bonding Characteristics of Nano Zn Film Al–Si Bonding Wires

Hung

Lui

Chu

et al. 2017

Metals

Self Cite

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“…Moreover, to better understand the differences between the Al-0.5Si and ZAS wires, current tests of the first bond (FAB) were compared [10][11][12][13][14] and the bias-tensile test of the wires with different currents was measured. The schematic diagram in Fig.…”

Section: Methodsmentioning

confidence: 99%

Aluminum Wires have the Free Air Balls (FABs): Electronic Flame-Off, Fracture Strength, Electrical Properties and Bonding Characteristics of Nano Zn Film Al-Si Bonding Wires

Hung

Lui

Chu

et al. 2016

Preprint

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Aluminum wire is a common material for wire bonding due to its resistance to oxidation and low price. It does not melt when becoming a free air ball (FAB) during the electronic flame-off (EFO) process with wettability, and is applied by wedge bonding. This study used 20μm Zn-Coated Al-0.5wt.%Si (ZAS) wires to improve the FAB shape after the EFO process, while maintaining stability of the mechanical properties, including the interface bonding strength and hardness. In order to test circuit stability after ball bonding, the current-tensile test was performed. During the experiment, it was found that 80nm ZAS with wire bonding has lower resistance and higher fusing current. For the bias tensile test, the thicker Zn film diffused into the Al-Si matrix easily, after which the strength was reduced. The ball-bond interfaces had no change in their condition before and after the bias. Accordingly, ZAS could be a promising candidate for ball bonding in the future.

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“…The size of the FAB is small (the diameter is approximately 35–55 μm), and it solidifies rapidly. The surface tension and solidification characteristics of the FAB during the melting process determine its shape [ 21 , 22 ]. Once the FAB is formed, it is bonded to the aluminum substrate of the chip, with the bonding parameters such as the bonding pressure, ultrasonic power, and bonding time, determining the bonding characteristics.…”

Section: Introductionmentioning

confidence: 99%

Effects of Bonding Parameters on Free Air Ball Properties and Bonded Strength of Ag-10Au-3.6Pd Alloy Bonding Wire

Cao

Zhang

Persic³

et al. 2020

Micromachines

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Free air ball (FAB) and bonded strength were performed on an Ag-10Au-3.6Pd alloy bonding wire (diameter of 0.025 mm) for different electronic flame-off (EFO) currents, times and bonding parameters. The effects of the EFO and bonding parameters on the characteristics of the FAB as well as the bonded strength were investigated using scanning electron microscopy. The results showed that, for a constant EFO time, the FAB of the Ag-10Au-3.6Pd alloy bonding wire transitioned from a pointed defined ball to an oval one, then to a perfectly shaped one, and finally to a golf ball with an increase in the EFO current. On the other hand, when the EFO current was constant and the EFO time was increased, the FAB changed from a small ball to a perfect one, then to a large one, and finally to a golf ball. The FAB exhibited the optimal geometry at an EFO current of 0.030 A and EFO time of 0.8 ms. Further, in the case of the Ag-10Au-3.6Pd alloy bonding wire, for an EFO current of 0.030 A, the FAB diameter exhibited a nonlinear relationship with the EFO time, which could be expressed by a quadratic function. Finally, the bonded strength decreased when the bonding power and force were excessively high, causing the ball bond to overflow. This led to the formation of neck cracks and decrease in the bonded strength. On the other hand, the bonded strength was insufficiently when the bonding power and force were small. The bonded strength was of the desired level when the bonding power and force were 70 mW and 0.60 N (for the ball bonded) and 95 mW and 0.85 N (for the wedge bonded), respectively.

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Effect of annealing on the microstructure and bonding interface properties of Ag–2Pd alloy wire

Cited by 25 publications

References 12 publications

Aluminium Wires Have the Free Air Balls (FABs): Electronic Flame-Off, Fracture Strength, Electrical Properties, and Bonding Characteristics of Nano Zn Film Al–Si Bonding Wires

Aluminium Wires Have the Free Air Balls (FABs): Electronic Flame-Off, Fracture Strength, Electrical Properties, and Bonding Characteristics of Nano Zn Film Al–Si Bonding Wires

Aluminum Wires have the Free Air Balls (FABs): Electronic Flame-Off, Fracture Strength, Electrical Properties and Bonding Characteristics of Nano Zn Film Al-Si Bonding Wires

Effects of Bonding Parameters on Free Air Ball Properties and Bonded Strength of Ag-10Au-3.6Pd Alloy Bonding Wire

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