Effect of annealing treatment on electromagnetic shielding effectiveness of double-layer FeSiBCuNb/Cu composite strips

Xu, Wenjie; Qi, Jingtao; Zhang, Yuyang; Zeng, Guoxun; Zhou, Yuxiong; Ou, Hongze; Zhou, Hao; Wu, Yi; Yang, Yuanzheng

doi:10.1007/s10854-022-09740-2

Cited by 3 publications

(2 citation statements)

References 38 publications

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“…ii) to manufacture copper-based composites with additions of strengthening elements (e. g. powder-based copper composites with chromium, alumina, or carbon and its nanotubes, copper clad composites with aluminum, magnesium and aluminum, niobium, high entropy alloys, etc. [3][4][5][6][7][8]. iii) to use optimized thermomechanical (deformation) treatment (e. g. via rotary swaging, or methods of severe plastic deformation) [9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Correlation of structure development and electric characteristics within high pressure torsion processed copper

Kocich,

Kopeček,

Marek

2024

Materialwissenschaft Werkst

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Copper of a high purity features excellent electric conductivity, but generally very low mechanical properties. Nevertheless, optimized deformation/thermomechanical treatment can introduce favorable combinations of both. The presented study characterizes the correlation of microstructure development and electric properties within copper processed by the severe plastic deformation method of high pressure torsion, the primary advantage of which is that it enables to achieve grains with the sizes in the ultra‐fine, or even nano scales. The study investigates structure development during progressive deformation. In other words, samples processed by single and double high pressure torsion revolutions were evaluated from the viewpoints of grain sizes and grain boundaries, and the results were correlated with the experimentally measured electric conductivity. The single high pressure torsion revolution contributed to grain size decrease, while the structure after double revolution exhibited very fine grains, especially at the sample periphery featuring the highest imposed strain. Both the samples also exhibited increases in microhardness (especially after double revolution), and electric conductivity higher than 100 % IACS. The results confirmed that copper conductors featuring enhanced mechanical properties and favorable electric conductivity can be manufactured by severe plastic deformation.

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Section: Introductionmentioning

confidence: 99%

Correlation of structure development and electric characteristics within high pressure torsion processed copper

Kocich,

Kopeček,

Marek

2024

Materialwissenschaft Werkst

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“…Among the possibilities how to increase the mechanical properties and simultaneously maintain advantageous electric conductivity is to use modern methods and fabricate Cu-based composites featuring strengthening elements (e.g., powder-based composites with additions of Cr [ 5 ], Al 2 O 3 [ 6 ], and carbon nanotubes [ 7 ], or clad composites consisting of Cu plus Al [ 8 , 9 , 10 , 11 ], Al and Mg [ 12 ], Nb [ 13 ], and FeSiBCuNb [ 14 ]). A favorable way how to increase the mechanical properties without deteriorating the electric ones can also be optimized deformation (thermomechanical) treatment–such as fabrication of electro-conductive wires via rotary swaging [ 15 ] or processing via methods of severe plastic deformation (SPD) [ 16 ].…”

Section: Introductionmentioning

confidence: 99%

High Pressure Torsion of Copper; Effect of Processing Temperature on Structural Features, Microhardness and Electric Conductivity

2023

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By optimizing the fabrication method, copper components featuring (typically contradicting) advantageous electric conductivity and favorable mechanical properties can be acquired. In this study, we subjected conventional electroconductive copper to a single revolution of high pressure torsion (HPT) at room temperature (RT), searched for the conditions which would yield comparable structure characteristics (grain size) when deformed at a cryogenic temperature, and finally compared the mechanical and electric behaviors to assess specific differences and correlate them with the (sub)structural development. 180° revolution of cryo-HPT imparted structure refinement comparable to 360° revolution of room temperature HPT, i.e., the average grain size at the periphery of both the specimens was ~7 µm. The 360° RT HPT specimen exhibited preferential (111)||SD (shear direction) texture fiber in all the examined regions, whereas the 180° cryo-HPT specimen exhibited more or less randomly oriented grains of equiaxed shapes featuring substantial substructure development of a relatively homogeneous character and massive occurrence of (nano)twins. These structural features resulted in the increase in microhardness to the average value of 118.2 HV0.2 and the increase in the electric conductivity to 59.66 MS·m−1 (compared to 105 HV0.2 and 59.14 MS·m−1 acquired for the 360° RT HPT specimen). The deformation under the cryogenic conditions also imparted higher homogeneity of microhardness distribution when compared to RT processing.

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Deformation Behavior of La₂O₃‐Doped Copper during Equal Channel Angular Pressing

Kunčická,

Walek,

Kocich

2024

Adv Eng Mater

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Pure copper has a very low strength of not more than 20 MPa. Nevertheless, its mechanical properties can be enhanced by (micro)alloying, additions of strengthening particles/elements, or imparting structure modifications/grain refinement via (severe) shear strain. The presented study proposes a way of strengthening commercially pure copper by combining 5 wt% addition of La2O3 particles and deformation processing. The composite is vacuum induction cast and subsequently processed by the equal channel angular pressing (ECAP) severe plastic deformation method. Single‐pass ECAP through a die with 110° angle is selected to observe the effect of La2O3 addition on the development of substructure at the beginning of plastic deformation. The results show that the addition of oxide particles not only enhances the microhardness, but also efficiently supports the development of subgrains and shear bands during deformation, which finally results in an increase in the microhardness of the composite to more than double the original copper value. Although the presence of La2O3 particles slightly decreases the electric conductivity, the subsequent ECAP processing provides the final composite with a conductivity of 97.9% IACS (International Annealed Copper Standard), as it promotes the alignment of the strengthening particles along the developed shear bands.

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Effect of annealing treatment on electromagnetic shielding effectiveness of double-layer FeSiBCuNb/Cu composite strips

Cited by 3 publications

References 38 publications

Correlation of structure development and electric characteristics within high pressure torsion processed copper

Correlation of structure development and electric characteristics within high pressure torsion processed copper

High Pressure Torsion of Copper; Effect of Processing Temperature on Structural Features, Microhardness and Electric Conductivity

Deformation Behavior of La₂O₃‐Doped Copper during Equal Channel Angular Pressing

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Effect of annealing treatment on electromagnetic shielding effectiveness of double-layer FeSiBCuNb/Cu composite strips

Cited by 3 publications

References 38 publications

Correlation of structure development and electric characteristics within high pressure torsion processed copper

Correlation of structure development and electric characteristics within high pressure torsion processed copper

High Pressure Torsion of Copper; Effect of Processing Temperature on Structural Features, Microhardness and Electric Conductivity

Deformation Behavior of La2O3‐Doped Copper during Equal Channel Angular Pressing

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Deformation Behavior of La₂O₃‐Doped Copper during Equal Channel Angular Pressing