Effect of atomic oxygen exposure on polybenzoxazine/POSS nanocomposites for space applications

He, Yanjun; Suliga, Agnieszka; Brinkmeyer, Alex; Schenk, Mark; Hamerton, Ian

doi:10.1016/j.compositesa.2023.107898

Cited by 4 publications

(1 citation statement)

References 39 publications

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“…The toughness of epoxy resins can be improved via inter-molecular interactions between the thermosetting polymers (PBZ) and the O-H functional groups [ 35 , 36 , 37 , 38 , 39 ] that occur after carrying out the polymerization. POSS hybrids mixed into a polymer can be categorized as end-chain or side-chain varieties and created using mono-functional or multi-functional POSS nanomaterials [ 40 , 41 , 42 , 43 , 44 , 45 , 46 ]. The latter leads to the formation of insoluble crosslinking structures.…”

Section: Introductionmentioning

confidence: 99%

High-Thermal Stable Epoxy Resin through Blending Nanoarchitectonics with Double-Decker-Shaped Polyhedral Silsesquioxane-Functionalized Benzoxazine Derivatives

Kao,

Lin,

Chen

et al. 2023

Polymers

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A series of di-functional benzoxazine (BZ) monomers was synthesized, specifically the double-decker silsesquioxane (DDSQ) cage structure (DDSQ-BZ). Comparative analyses were conducted between DDSQ-BZ monomers and the most commonly utilized bisphenol A-functionalized bifunctional benzoxazine (BPA-BZ) monomer. DDSQ-BZ compounds possess better thermal properties such as high char yield and high thermal decomposition temperature (Td10) after thermal ring-opening polymerization (ROP) because the inorganic DDSQ cage nanostructure features a nano-reinforcement effect. In addition, blending inorganic DDSQ-BZ compounds with epoxy resin was explored to form organic/inorganic hybrids with enhanced thermal and mechanical properties following thermal ROP. The improvement in mechanical properties is primarily attributed to the network structure formed by the cross-linking between DDSQ-BZ and the epoxy resin during thermal ROP, as well as hydrogen bonding interactions formed between the hydroxyl groups generated during thermal ROP and the Si-O-Si bonds in the DDSQ structure.

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