2019
DOI: 10.1016/j.cap.2019.03.016
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Effect of balanced and unbalanced magnetron sputtering processes on the properties of SnO2 thin films

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Cited by 33 publications
(18 citation statements)
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“…As a result, the excess power at 2500 and 3000 W mainly focuses on Ar*, leading to severe bombardment and destruction of films. This result is similar to some studies with high power [ 4 , 12 , 13 ]. The ratio of Sn 4+ /(Sn 2+ +Sn 4+ ) is also revealed in the Figure 5 b.…”
Section: Resultssupporting
confidence: 92%
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“…As a result, the excess power at 2500 and 3000 W mainly focuses on Ar*, leading to severe bombardment and destruction of films. This result is similar to some studies with high power [ 4 , 12 , 13 ]. The ratio of Sn 4+ /(Sn 2+ +Sn 4+ ) is also revealed in the Figure 5 b.…”
Section: Resultssupporting
confidence: 92%
“…This bond breaking occurs when the energy of Ar* is higher than 5.48 eV [ 40 ] as shown in the inset of Figure 2 c. As a consequence, the induced ion bombardment by too high a power will cause the serious damage to the deposited films although the saturation oxidation reaction is obtained. The deterioration of the film properties due to the strong plasma bombardment can also be found in some researches via MSD [ 4 ], and laser-assisted [ 12 ] or plasma enhanced CVD [ 13 ].…”
Section: Resultsmentioning
confidence: 99%
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“…It is known that MS is a technique for the preparation of thin film based on gas discharge; the partial pressure of introduced oxygen is critical to the sputtering state when performing RMS from the metallic target [ 24 ]. Hence, we first investigated the target voltage as a function of Ar/O 2 flow ratios at a fixed working pressure, as shown in Figure 1 a.…”
Section: Resultsmentioning
confidence: 99%