Effect of bismuth and silver on the corrosion behavior of Sn–9Zn alloy in NaCl 3wt.% solution

Ahmido, Adnane; Sabbar, A.; Zouihri, Hafid; Dakhsi, Khalid; Guédira, F.; Serghini-Idrissi, Malika; Hajjaji, Souad El

doi:10.1016/j.mseb.2011.05.034

Cited by 31 publications

(13 citation statements)

References 36 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Further advantage of adding bismuth into Sn-Ag system solder is the improvement of solder wetting/spreading behaviour [15,16]. It was also already shown that bismuth and silver can have a significant impact on the corrosion properties in case of Sn-based solder alloy in NaCl solutions [17,18]. Furthermore, the influence of bismuth addition on the microstructure and the properties of Sn-rich SnAg lead-free solders has been also widely studied [13,[19][20][21][22][23].…”

Section: Discussionmentioning

confidence: 99%

See 1 more Smart Citation

Effect of Bismuth and Silver on the Corrosion Behavior of Lead-free Solders in 3.5 wt% NaCl Solution

Tamasi

Kosa

Szabó

et al. 2016

Period. Polytech. Elec. Eng. Comp. Sci.

View full text Add to dashboard Cite

IntroductionOne of the key reliability issues of the electronics technology is carry about the solder joints testing. Usually, the different failures can lead back to the not adequate physical properties (e.g. wetting behaviour, mechanical strength, etc.) of the solder alloy and/or the not adequate applied technological processes (e.g. reflow temperature profile), which have to be improved. This challenge was updated in 2006, with the introduction of lead-free solder alloys governed by the RoHS directive of EU [1]. Due to the lead-free limitations, different solder types such as near-eutectic Tin-Silver, Tin-Copper, and Tin-Zinc alloys were produced as replacement for Tin-Lead solder materials. Furthermore, solders with more alloying elements, such as (Tin-Silver-Copper, Tin-Zinc-Silver, Tin-Zinc-Indium) and/or (Tin-Zinc-Silver-Aluminum, Tin-Silver-Bismuth-Copper, TinIndium-Silver-Antimony) were also investigated as replacements for Pb-free types [2]. While, the different qualifying studies of the Pb-free solder alloys are even active topics [3] and one of the issues is carry about humidity induced failures, like electrochemical corrosion [4,5]. Different results were also published related to novel Pb-free solder alloys in terms of reliability topics, such as solderability [6], intermetallic layer (IML) investigation [7], shear force tests [8], wetting investigations [9] or (solid state physics) migration tests [10]. On the other hand, the investigations of humidity induced failures (like corrosion) of Pb-free solder alloys are not deeply addressed in the scientific publications. In our former publication [11], various microalloyed Pb-free solders tested in terms of corrosion resistance using electroanalytical tests. In that study [11] different Pb-free solder alloys (four micro-alloyed and a Sn96.5Ag3Cu0.5 alloy as reference) were compared using potentiodynamic polarisation tests. During polarisation tests, the sample (working electrode) is scanned from a cathodic polarisation state, and after reaching the corrosion potential (Ecorr) it begins anodic polarisation. When the sample reaches the passivation potential, if possible a passivation film begins to form on the surface and the current density at this point is called the critical current density (Icrit). After this point the corrosion current density begins to drop to a much lower value. When a compact passivation film

show abstract

Section: Discussionmentioning

confidence: 99%

“…Finally, it was highlighted that the silver and bismuth content may pose a relative high corrosion risk related to micro-alloyed solder alloys used in electronics. The reason could be that the corrosion potential (Ecorr) is shifted towards less noble values with the addition of bismuth and silver (See Table 2 and [18]). …”

Section: Discussionmentioning

confidence: 99%

Effect of Bismuth and Silver on the Corrosion Behavior of Lead-free Solders in 3.5 wt% NaCl Solution

Tamasi

Kosa

Szabó

et al. 2016

Period. Polytech. Elec. Eng. Comp. Sci.

View full text Add to dashboard Cite

show abstract

“…Ni, Al, Ag, Cu, Cr, and Ti) have been considered as additives into Sn-Zn alloys for the purposes of improving the corrosion resistance. However, to the best of our knowledge, limited study has been given to the low-melting point elements such as In and Bi; despite that Ahmido et al [16,17] reported Bi addition could improve the corrosion resistance of Sn-9Zn, but limited explanation for the mechanism. In the present work, Sn-3Zn-xBi (x=0, 1, 3, 5, 7 wt.%) solder alloys were prepared, and the electrochemical behaviour was investigated using potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) techniques, aiming to assess the effect of Bi on the corrosion properties of the Sn-Zn alloy.…”

Section: Introductionmentioning

confidence: 98%

Electrochemical corrosion behaviour of Sn-Zn-xBi alloys used for miniature detonating cords

Liu

Khorsand

2019

Journal of Materials Science & Technology

View full text Add to dashboard Cite

Electrochemical corrosion behaviour of Sn-3Zn-xBi (x=0, 1, 3, 5, 7 wt.%) solder alloys were investigated using potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) techniques, to explore the effect of Bi on corrosion performance of the Sn-Zn alloy. Results indicated that minor (1 wt.%) Bi addition increased the corrosion susceptibility, mainly attributed to the coarsened and more uniformly distributed Zn-rich precipitates, while further increasing Bi decreased the corrosion susceptibility due to the higher fraction of nobler Bi particles serving as anodic barriers. The Sn-3Zn-7Bi possessed the best corrosion resistance among all alloys. The role of Bi on corrosion was considerably discussed.

show abstract

“…Thereafter, it exhibits pitting properties as shown in Fig. 3, and this is potentially due to the attack of Cl − ions on the passive film and formation of a non-protective zincate (ZnO/ZnCl 2 ) film for extremely short duration of exposure although it forms different Al and Zn corrosion products containing Cl − /OH − ions, such as Al, Zn, and Zn 5 (OH) 8 Cl 2 .H 2 O compounds, at longer durations of exposure 49,50 .…”

Section: Resultsmentioning

confidence: 99%

Corrosion mechanism and kinetics of Al-Zn coating deposited by arc thermal spraying process in saline solution at prolong exposure periods

Lee

Singh

Ismail

et al. 2019

Sci Rep

View full text Add to dashboard Cite

Steel structures significantly degrades owing to corrosion especially in coastal and industrial areas where significant amounts of aggressive ions are present. Therefore, anodic metals such as Al and Zn are used to protect steel. In the present study, we provide insights for the corrosion mechanism and kinetics of Al-Zn pseudo alloy coating deposited on mild steel plate via an arc thermal spraying process in 3.5 wt.% NaCl solution in terms of its improved corrosion resistance properties at prolonged exposure durations. Electrochemical studies including open circuit potential (OCP) and electrochemical impedance spectroscopy (EIS) on the deposited coating at longer exposure durations revealed enhanced corrosion resistance properties while the morphology of corrosion products through field emission-scanning electron microscopy (FE-SEM) indicated their compactness and adherence. Furthermore, atomic force microscopy (AFM) confirmed reduced roughness when compared with that of unexposed coating. Additionally, X-ray diffraction (XRD) and Raman spectroscopy results confirmed the formation of protective, adherent, and sparingly soluble Simonkolleite (Zn 5 (OH) 8 Cl 2 .H 2 O) after 55 d of exposure in 3.5 wt.% NaCl solution. A schematic is proposed that explains the corrosion process of Al–Zn pseudo alloy coating in 3.5 wt.% NaCl solution from the deposition of coating and initiation of corrosion to longer exposure durations.

show abstract

Effect of bismuth and silver on the corrosion behavior of Sn–9Zn alloy in NaCl 3wt.% solution

Cited by 31 publications

References 36 publications

Effect of Bismuth and Silver on the Corrosion Behavior of Lead-free Solders in 3.5 wt% NaCl Solution

Effect of Bismuth and Silver on the Corrosion Behavior of Lead-free Solders in 3.5 wt% NaCl Solution

Electrochemical corrosion behaviour of Sn-Zn-xBi alloys used for miniature detonating cords

Corrosion mechanism and kinetics of Al-Zn coating deposited by arc thermal spraying process in saline solution at prolong exposure periods

Contact Info

Product

Resources

About