Effect of Blending Modifications for Phenylethynyl-terminated Polyimides

Yu, Ping; Xue, Minzhao; Liu, Yangang; Yang, Xue; Pan, Lijing; Wang, Wei

doi:10.1007/s12221-020-1260-3

Cited by 3 publications

(3 citation statements)

References 26 publications

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“…Symmetric or asymmetric stretching vibration peaks of CO appeared at 1775 cm −1 and 1712 cm −1 , indicating the generation of the imide ring. 26 Moreover, the symmetric or asymmetric stretching vibration peaks of CN, C–O, and C–F appeared at 1596 cm −1 , 1272 cm −1 , and 1134 cm −1 , respectively; 27,28 skeletal vibration absorption peaks of the benzene ring and characteristic absorption peaks of the methyl group also appeared at 1509 cm −1 and 1362 cm −1 , which indicated that both PBAB6F and BPADA were successfully introduced into the polymer. 12 Combined with 1 H NMR (Fig.…”

Section: Resultsmentioning

confidence: 93%

Preparation of fluorinated poly(benzoxazole-co-imide) with low dielectric constants based on the thermal rearrangement reaction of o-hydroxy polyimides

Li,

et al. 2024

J. Mater. Chem. C

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Section: Resultsmentioning

confidence: 93%

Preparation of fluorinated poly(benzoxazole-co-imide) with low dielectric constants based on the thermal rearrangement reaction of o-hydroxy polyimides

Li,

et al. 2024

J. Mater. Chem. C

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“…And the characteristic absorptions of the imide ring structure at 1780, 1720 and 1370, 740 cm −1 appeared, due to the C=O asymmetric and symmetric stretching vibrations and the C-N stretching and bending vibrations, and their intensities were increased with the increasing treatment temperature of the blend resins. In addition, the absorptions at 2210 cm −1 , attributed to the carbon-carbon stretching vibrations in phenylethynyl groups (-C≡C-), were not disappeared even after being thermally treated at 260 °C, implying that no obvious thermal curing reaction occurred [ 39 ]. The characteristic peaks of isoimide around 1800 cm −1 and 905 cm −1 were not detected, implying that the imidization process didn’t produce the corresponding isoimide groups [ 40 ].…”

Section: Resultsmentioning

confidence: 99%

“…The results indicated that the thermosetting blend resins followed the first-order kinetics of phenylethynyl-terminated resins [ 42 ]. A two-staged kinetic/diffusion model could be used to explain the curing process of the thermosetting blend resins, which possess more dynamic endcaps and more rigid molecular chains [ 39 ]. The dominating reactions during thermal cure are ethynyl to ethynyl addition.…”

Section: Resultsmentioning

confidence: 99%

Improved Melt Processabilities of Thermosetting Polyimide Matrix Resins for High Temperature Carbon Fiber Composite Applications

et al. 2022

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With the goal of improving processability of imide oligomers and achieving of high temperature carbon fiber composite, a series of Thermosetting Matrix Resin solutions (TMR) were prepared by polycondensation of aromatic diamine (3,4′-oxybisbenzenamine, 3,4-ODA) and diester of biphenylene diacid (BPDE) using monoester of 4-phenylethynylphthalic acid (PEPE) as end-capping agent in ethyl alcohol as solvent to afford phenylethynyl-endcapped poly(amic ester) resins with calculated molecular weight (Calc’d Mw) of 1500–10,000. Meanwhile, a series of reactive diluent solutions (RDm) with Calc’d Mw of 600–2100 were also prepared derived from aromatic diamine (4,4′-oxybisbenzenamine, 4,4-ODA), diester of asymmetrical biphenylene diacid (α-BPDE) and monoester of 4-phenylethynylphthalic acid (PEPE) in ethyl alcohol. Then, the TMR solution was mixed with the RDm solution at different weight ratios to afford a series of A-staged thermosetting blend resin (TMR/RDm) solutions for carbon fiber composites. Experimental results demonstrated that the thermosetting blend resins exhibited improved melt processability and excellent thermal stability. After being thermally treated at 200 °C/1 h, the B-staged TMR/RDm showed very low melt viscosities and wider processing window. The minimum melt viscosities of ≤50 Pa·s was measured at ≤368 °C and the temperature scale at melt viscosities of ≤100 Pa·s were detected at 310–390 °C, respectively. The thermally cured neat resins at 380 °C/2 h showed a great combination of mechanical and thermal properties, including tensile strength of 84.0 MPa, elongation at breakage of 4.1%, and glass transition temperature (Tg) of 423 °C, successively. The carbon fiber reinforced polyimide composite processed by autoclave technique exhibited excellent mechanical properties both at room temperature and 370 °C. This study paved the way for the development of high-temperature resistant carbon fiber resin composites for use in complicated aeronautical structures.

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Development of Benzimidazole‐Containing Thermosetting Imide Oligomers With Enhanced Thermal Stability and Adhesive Properties

Liu,

Zhang,

Sun

et al. 2024

J of Applied Polymer Sci

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In this work, phenylethynyl‐terminated imide oligomers incorporating benzimidazole structures were synthesized and their structures were characterized using Fourier transform infrared spectroscopy (FT‐IR), X‐ray diffraction (XRD), and proton nuclear magnetic resonance (1H NMR). The solubility, curing behavior, thermal stability, thermomechanical properties, and adhesive performance were systematically evaluated. Different dianhydride structures and isomer ratios were utilized to optimize the performance of the oligomers. Thermogravimetric analysis (TGA) revealed 5% weight loss temperatures (T5%) exceeding 520°C under both nitrogen and air atmospheres, demonstrating excellent thermal stability. Lap shear strength (LSS) testing showed that oligomers based on 4,4′‐oxydiphthalic anhydride (ODPA) exhibited superior adhesive performance, particularly at elevated temperatures. The glass transition temperature (Tg) was significantly influenced by the ratio of 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (s‐BPDA) to 2,3,3′,4′‐biphenyltetracarboxylic dianhydride (a‐BPDA), with a maximum Tg of 482°C. These results underscore the potential of these oligomers for high‐performance adhesive applications in industries such as aerospace and electronics.

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Effect of Blending Modifications for Phenylethynyl-terminated Polyimides

Cited by 3 publications

References 26 publications

Preparation of fluorinated poly(benzoxazole-co-imide) with low dielectric constants based on the thermal rearrangement reaction of o-hydroxy polyimides

Preparation of fluorinated poly(benzoxazole-co-imide) with low dielectric constants based on the thermal rearrangement reaction of o-hydroxy polyimides

Improved Melt Processabilities of Thermosetting Polyimide Matrix Resins for High Temperature Carbon Fiber Composite Applications

Development of Benzimidazole‐Containing Thermosetting Imide Oligomers With Enhanced Thermal Stability and Adhesive Properties

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