2020 China Semiconductor Technology International Conference (CSTIC) 2020
DOI: 10.1109/cstic49141.2020.9282527
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Effect of Bonded Ball Shape on Gold Wire Bonding Quality Based on ANSYS/LS-DYNA Simulation

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“…Among them, there is a cavity between the rivet and the CFRP plate in the simulated cross-section and the deformation of the Al plate is somewhat different from the experimental result, which can be explained by the overly-stiff response of the Al plate during the SPR forming process. 52 This has little effect on the acquisition of key parameters.…”
Section: Model Validation and Discussionmentioning
confidence: 99%
“…Among them, there is a cavity between the rivet and the CFRP plate in the simulated cross-section and the deformation of the Al plate is somewhat different from the experimental result, which can be explained by the overly-stiff response of the Al plate during the SPR forming process. 52 This has little effect on the acquisition of key parameters.…”
Section: Model Validation and Discussionmentioning
confidence: 99%