Effect of bump shapes on the electromigration reliability of copper pillar solder joints

Fan, Zhekun; Li, Zhankun; Li, Junhui; Xiao, Jinqing; Liu, Yunpeng; Liu, Junfu; Chen, Taotao

doi:10.1109/icept52650.2021.9568080

Cited by 2 publications

(2 citation statements)

References 6 publications

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“…Existing research has identified several methods to improve the failure of solder bumps induced by current crowding. One approach is to optimize the interconnect structure and use different-shaped solder bumps [27]. Other methods involve reducing the pad opening size and bump height [28] and optimizing the layout of the solder bump array.…”

Section: Electrical Reliabilitymentioning

confidence: 99%

“…Fan conducted electro-thermal-mechanical coupling analysis on cylindrical, hourglass, and barrel-shaped bumps, obtaining the current density distribution, temperature distribution, and equivalent stress distribution for the three bump shapes. It was found that cylindrical bumps were a good choice for improving the resistance to electromigration in copper pillar interconnect structures [27]. WLP is also an advanced packaging technology.…”

Section: Current Status Of Reliability Research On Multi-field Coupli...mentioning

confidence: 99%

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Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Wang,

Liu,

Huo

et al. 2024

Micromachines

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With the advancement of Moore’s Law reaching its limits, advanced packaging technologies represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and 3D packaging have received significant attention. While advanced packaging has made breakthroughs in achieving high performance, miniaturization, and low cost, the smaller thermal space and higher power density have created complex physical fields such as electricity, heat, and stress. The packaging interconnects responsible for electrical transmission are prone to serious reliability issues, leading to the device’s failure. Therefore, conducting multi-field coupling research on the reliability of advanced packaging interconnects is necessary. The development of packaging and the characteristics of advanced packaging are reviewed. The reliability issues of advanced packaging under thermal, electrical, and electromagnetic fields are discussed, as well as the methods and current research of multi-field coupling in advanced packaging. Finally, the prospect of the multi-field coupling reliability of advanced packaging is summarized to provide references for the reliability research of advanced packaging.

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Section: Electrical Reliabilitymentioning

confidence: 99%

Section: Current Status Of Reliability Research On Multi-field Coupli...mentioning

confidence: 99%

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Wang,

Liu,

Huo

et al. 2024

Micromachines

View full text Add to dashboard Cite

show abstract

Isothermal aging and electromigration reliability of Cu pillar bumps interconnections in advanced packages monitored by in-situ dynamic resistance testing

Wang,

Feng,

Wang

et al. 2024

Journal of Materials Research and Technology

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Effect of bump shapes on the electromigration reliability of copper pillar solder joints

Cited by 2 publications

References 6 publications

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Isothermal aging and electromigration reliability of Cu pillar bumps interconnections in advanced packages monitored by in-situ dynamic resistance testing

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