2017
DOI: 10.1109/jmems.2016.2646759
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Effect of Capillary Forces in Room Temperature Si-Si Direct Bonding Technique Using Velcrolike Surfaces

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Cited by 2 publications
(3 citation statements)
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“…Single needles were typically stuck together at the top forming clusters of needles through a self-attaching mechanism, due to either strongly induced capillary forces between them during rinsing and drying processes or their formation process. 5 Due to nonuniformity of pores pitches and sizes, configurations of macro-pores, 12 and clustering behavior of needles, clustered needles with inhomogeneous lengths, diameter, and separation were obtained. Morphology of needle-like surfaces was investigated through surface SEM images.…”
Section: Impact Of Current Density On Morphology Of Needle-like Surfa...mentioning
confidence: 99%
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“…Single needles were typically stuck together at the top forming clusters of needles through a self-attaching mechanism, due to either strongly induced capillary forces between them during rinsing and drying processes or their formation process. 5 Due to nonuniformity of pores pitches and sizes, configurations of macro-pores, 12 and clustering behavior of needles, clustered needles with inhomogeneous lengths, diameter, and separation were obtained. Morphology of needle-like surfaces was investigated through surface SEM images.…”
Section: Impact Of Current Density On Morphology Of Needle-like Surfa...mentioning
confidence: 99%
“…2 Usage of the anodization technique to create needle-like Si surfaces for room temperature Si-Si bonding applications has currently attracted attention. [3][4][5] Additionally, the technique has a good potential to easily replace complicated and costly processes, such as inductively coupled plasma reactive ion etching (ICP-RIE), 6 interference lithography combined with Reactive Ion Etching (RIE) technique, 7 metal-assisted etching (MAE) technique, 8 and laser micro/nano-processing, 9 which are commonly used to generate Si needle-like antireflection coating surfaces for visible and (near infrared) NIR applications.…”
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confidence: 99%
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