Effect of Carbon/Carbon Preform Density on the Microstructure and Properties of Mo₂C Interlayer‐Modified Carbon/Carbon–Copper Composites for Sliding Contact Materials

Abstract

Carbon/carbon-copper(C/C-Cu) composites were fabricated by pressure-less infiltration of Cu into carbon/carbon (C/C) preforms modified with Mo 2 C interlayer by a molten salt method. Cu filled the pores inside the Mo 2 C-modified preforms fully, and retained an interconnected net-like distribution in the C/C-Cu composites. The electrical resistivity and flexural strength increased, whereas impact toughness decreased with the increase of preform density. Fiber pull-out and crack propagation along the interface contributed to the pseudo-plastic behavior of the composites. The tribological performance was improved with the increase of preform density due to the better lubrication of transfer films.