Effect of chemical structures and environmental factors on the thermal degradation mechanism of polyimide: Experiments and molecular dynamics simulations

Xu, Shiqin; Lin, Daolei; Li, Runyue; Zhan, Jiayu; Tian, Guofeng; Wu, Dezhen

doi:10.1016/j.mtchem.2024.102242

Materials Today Chemistry

2024

DOI: 10.1016/j.mtchem.2024.102242

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Effect of chemical structures and environmental factors on the thermal degradation mechanism of polyimide: Experiments and molecular dynamics simulations

Shiqin Xu,

Daolei Lin,

Runyue Li

et al.

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Development of Benzimidazole‐Containing Thermosetting Imide Oligomers With Enhanced Thermal Stability and Adhesive Properties

Liu,

Zhang,

Sun

et al. 2024

J of Applied Polymer Sci

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In this work, phenylethynyl‐terminated imide oligomers incorporating benzimidazole structures were synthesized and their structures were characterized using Fourier transform infrared spectroscopy (FT‐IR), X‐ray diffraction (XRD), and proton nuclear magnetic resonance (1H NMR). The solubility, curing behavior, thermal stability, thermomechanical properties, and adhesive performance were systematically evaluated. Different dianhydride structures and isomer ratios were utilized to optimize the performance of the oligomers. Thermogravimetric analysis (TGA) revealed 5% weight loss temperatures (T5%) exceeding 520°C under both nitrogen and air atmospheres, demonstrating excellent thermal stability. Lap shear strength (LSS) testing showed that oligomers based on 4,4′‐oxydiphthalic anhydride (ODPA) exhibited superior adhesive performance, particularly at elevated temperatures. The glass transition temperature (Tg) was significantly influenced by the ratio of 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (s‐BPDA) to 2,3,3′,4′‐biphenyltetracarboxylic dianhydride (a‐BPDA), with a maximum Tg of 482°C. These results underscore the potential of these oligomers for high‐performance adhesive applications in industries such as aerospace and electronics.

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Development of Benzimidazole‐Containing Thermosetting Imide Oligomers With Enhanced Thermal Stability and Adhesive Properties

Liu,

Zhang,

Sun

et al. 2024

J of Applied Polymer Sci

View full text Add to dashboard Cite

show abstract

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Effect of chemical structures and environmental factors on the thermal degradation mechanism of polyimide: Experiments and molecular dynamics simulations

Cited by 1 publication

References 42 publications

Development of Benzimidazole‐Containing Thermosetting Imide Oligomers With Enhanced Thermal Stability and Adhesive Properties

Development of Benzimidazole‐Containing Thermosetting Imide Oligomers With Enhanced Thermal Stability and Adhesive Properties

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