Effect of Chloride Electrolyte Additive on the Quality of Electrorefined Copper Cathode

Nkuna, E.H.; Popoola, A. P. I.

doi:10.1016/j.promfg.2019.06.024

Cited by 12 publications

(6 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…However, Aragón and Camus (2011) found that better quality copper cathode was obtained in the presence of chloride ions, because chloride reduces the grain size and improves the mechanical properties of the cathode. This is corroborated by a more recent study (Nkuna and Popoola, 2019), which indicates that a chloride ion concentration of 0.02 g/L gave a smoother and more compact cathode. However, nodules and irregularities formed on the cathode at a concentration above 0.025 g/L.…”

Section: Effect Of Chloride On Copper Electrowinningsupporting

confidence: 81%

“…The influence of chloride ions contained in seawater on the solvent extraction (SX) process has also been studied, with the results being similar to use of fresh water, and sometimes even better (Shakibania et al, 2020). Additionally, in the copper electrowinning (EW) process, the presence of chloride ions at a concentration of 0.02 g/L can improve the compaction and smoothness of cathodes (Nkuna and Popoola, 2019).…”

Section: Use Of Seawater In Copper Hydrometallurgical Processesmentioning

confidence: 99%

See 1 more Smart Citation

The use of seawater in copper hydrometallurgical processing in Chile: A review

Astudillo,

Garcia,

Quezada

et al. 2023

J. S. Afr. Inst. Min. Metall.

View full text Add to dashboard Cite

Seawater has become a viable alternative for different uses in copper hydrometallurgy. In this paper we review the main physical and chemical characteristics of seawater and how these influence copper production. Reliable data on the use of continental water are reported, and the current use and consumption of seawater in the Chilean mining industry is analysed, indicating the main areas of use and the main problems encountered. Additionally, the influence of the elements in seawaterthat have the most influence on the extractive metallurgy of copper are considered. The Chilean copper mining industry currently consumes approximately 4.1 m3/s of seawater, which corresponds to 25% of the total water used. The use of seawater for the leaching of copper sulphide minerals, such as chalcopyrite, is beneficial because it provides 20 g/L of chloride, thereby improving copper dissolution kinetics.

show abstract

Section: Effect Of Chloride On Copper Electrowinningsupporting

confidence: 81%

Section: Use Of Seawater In Copper Hydrometallurgical Processesmentioning

confidence: 99%

The use of seawater in copper hydrometallurgical processing in Chile: A review

Astudillo,

Garcia,

Quezada

et al. 2023

J. S. Afr. Inst. Min. Metall.

View full text Add to dashboard Cite

show abstract

“…The electrolyte additives enable the deposition of fine-grained copper cathodes and a smooth surface free from dendrites, and they counteract the growth of dendrites. They can be divided into leveling agents, ensuring the uniformity of the cathode deposit, and grain-refining agents, affecting the orientation of the crystals [8][9][10]. Currently known inhibitors of the industrial copper electrorefining process include glue, thiourea, avitone, and also inorganic chloride ions [11][12][13][14][15][16][17][18].…”

Section: Introductionmentioning

confidence: 99%

Novel Additives in Copper Electrorefining—Small Laboratory Scale

Kowalik,

Kopyto,

Leszczyńska-Sejda

et al. 2024

Materials

View full text Add to dashboard Cite

This research aimed to evaluate the effectiveness of new organic substances, including a novel ionic liquid based on polyhexamethylenebiguanidine, polyhexamethyleneguanidine, and safranin in the copper electrorefining process. Experiments were conducted on a small laboratory scale using industrial copper anodes. Single doses of new additives did not improve process indicators (current efficiency, average cell voltage, specific energy consumption) or the quality of copper cathode deposits. However, a combination of a new ionic liquid based on polyhexamethylenebiguanidine and thiourea resulted in a satisfactory current efficiency of 97%, an average cell voltage of 0.110 V, a low specific energy consumption index of approximately 100 kWh/tCu, and smooth cathode surfaces. These results were superior to those obtained with industrial additives (bone glue and thiourea). The findings enhance our understanding of how these substances influence the electrorefining process and suggest the potential for more efficient and sustainable methods. Further research is recommended to validate these findings and explore their industrial applications.

show abstract

“…Levelers are used to obtain smooth coatings since they locally decrease the copper electrodeposition rate on the surface protrusions and promote its growth in hollows, as a result of which the surface roughness of the copper deposit decreases. Nitrogen-containing heterocyclic and high-molecular compounds are among the most common levelers [28][29][30][31][32].…”

Section: Introductionmentioning

confidence: 99%

“…The morphology and film properties of copper deposits highly depend on the types and concentrations of additives [33], but their collective effect on the electroplating process is also important. Along with the abovementioned joint action of chloride ions with inhibitor or accelerator molecules, it is necessary to note possible synergistic [6,31,32,[34][35][36] and antagonistic [37] effects of additives of various types. The synergism of the additives enables a bright, dense, and smooth copper coating to be achieved.…”

Section: Introductionmentioning

confidence: 99%

Electrocrystallization and Morphology of Copper Coatings in the Presence of Organic Additives

Kozaderov,

Sotskaya,

Yudenkova

et al. 2023

Coatings

View full text Add to dashboard Cite

Copper coatings with refined grains and smooth surface morphology were electrodeposited from electrolytes comprising a novel accelerator, the disodium salt of 4,4-dithiobenzene disulfonic acid (DBDA), with sodium chloride and polyethylene glycol (PEG) as inhibitors and 2-aminobenzothiazole (ABT) as a leveler. It was found that the morphology of the coatings strongly depends on the presence and type of additives. In the presence of only DBDA and NaCl, large crystallites are formed, whereas the addition of PEG and ABT significantly decreases their size, and the most fine-grained, smooth, and defect-free copper coating is formed with the combined use of all additives. To establish the correlation between the observed morphology and the kinetics of the additive-assisted copper electrocrystallization in the proposed electrolytes, the nucleation mechanism and its parameters were determined by transient electrochemical characterization. The extended nucleation model, which takes into account not only the copper deposition but also the electric double-layer charging and hydrogen reduction process, was used to establish the electrocrystallization kinetics in the presence of the additives. The results of such kinetic analyses can help to explain the morphological effect. By using the chronopotentiometry method, it was found that the addition of the disodium salt of 4,4-dithiobenzene disulfonic acid with chloride ions gives a catalytic effect, while the sequential introduction of polyethylene glycol and 2-aminobenzothiazole provides an increasing inhibitory effect. Voltamperometry and chronoamperometry tests showed that the process is controlled by the diffusion of ions to the growing three-dimensional cluster of a new phase. The introduction of additives into the electrolyte slows down the copper electroplating process at comparatively negative potentials and increases the probability of transition from instantaneous to progressive nucleation. Moreover, the rate of the process and the density of nucleation active sites increase (up to 2–3 times) with the addition of DBDA but decrease significantly (up to 5–8 times) in the presence of PEG and ABT, which additionally confirms their catalytic and inhibitory effects, respectively, and explains the significant smoothing effect on the morphology of the Cu-coatings.

show abstract

Effect of Chloride Electrolyte Additive on the Quality of Electrorefined Copper Cathode

Cited by 12 publications

References 5 publications

The use of seawater in copper hydrometallurgical processing in Chile: A review

The use of seawater in copper hydrometallurgical processing in Chile: A review

Novel Additives in Copper Electrorefining—Small Laboratory Scale

Electrocrystallization and Morphology of Copper Coatings in the Presence of Organic Additives

Contact Info

Product

Resources

About